Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Pia Tanskanen is active.

Publication


Featured researches published by Pia Tanskanen.


international symposium on electronics and the environment | 2007

Mobile phone take back learning's from various initiatives

Pia Tanskanen; Ed Butler

Takeback of obsolete electronics products has been in the focus of the environmental discussions for nearly 10 years. The European Union has published the WEEE directive which is implemented now in nearly all EU27 countries. In addition to The EU, the State of California has passed similar legislation with 34 additional states considering take back legislation. The trend continues in Canada, China and Latin America. The driving force for this is the increasing amount of consumer electronic products in the world and the desire to direct those products at the end of life to responsible recycling instead of landfill. Mobile phones are rich in metals and other natural resources allowing for economically viable recycling capturing resources such as gold, platinum, palladium and copper. One of the bottlenecks in the recycling chain has been the low return rates of the used products at the end of useful life. Consumers tend to want to keep the old products or are unaware of the take back vehicles available to them. This paper presents case studies from two countries where a variety of take back initiatives for mobile phones are in place. Raising awareness and providing easy take back options are explored as key factors in increasing the return rate of used electronics devices.


Acta Materialia | 2013

Management and recycling of electronic waste

Pia Tanskanen


Archive | 2003

Integrated electromechanical arrangement and method of production

Katri Närhi; Roope Takala; Jari Nousiainen; Pentti Ahlgren; Pia Tanskanen


Archive | 2005

Method for manufacturing a composite layer for an electronic device

Ramin Vatanparast; Mikko Aarras; Steven O. Dunford; Takaharu Fujii; Juhani Lainonen; Jaakko Nousiainen; Jukka Rantala; Pia Tanskanen; Tetsuya Yamamoto


Archive | 2009

Method for manufacturing a laminate cover, laminate protective layer, and laminate electronic device having a reduced cost, manufacturing time, weight, and thickness

Ramin Vatanparast; Mikko Aarras; Steven O. Dunford; Takaharu Fujii; Juhani Lainonen; Jaakko Nousiainen; Jukka Rantala; Pia Tanskanen; Tetsuya Yamamoto


Archive | 2009

Composite layer for an electronic device

Ramin Vatanparast; Mikko Aarras; Steven O. Dunford; Takaharu Fujii; Juhani Lainonen; Jaakko Nousiainen; Jukka Rantala; Pia Tanskanen; Tetsuya Yamamoto


Archive | 2006

Method for manufacturing a laminate cover, laminate protective layer, and laminate electronic device

Ramin Vatanparast; Mikko Aarras; Steven O. Dunford; Takaharu Fujii; Juhani Lainonen; Jaakko Nousiainen; Jukka Rantala; Pia Tanskanen; Tetsuya Yamamoto


Archive | 2006

INTEGRIERTE ELEKTROCHEMISCHE ANORDNUNG UND HERSTELLUNGSVERFAHREN

Katri Närhi; Roope Takala; Jari Nousiainen; Pentti Ahlgren; Pia Tanskanen


Archive | 2004

Integrated electrochemical arrangement and manufacturing processes

Pentti Ahlgren; Katri Närhi; Jari Nousiainen; Roope Takala; Pia Tanskanen


Archive | 2004

Appareil electromecanique integre et procede de fabrication

Katri Närhi; Roope Takala; Jari Nousiainen; Pentti Ahlgren; Pia Tanskanen

Researchain Logo
Decentralizing Knowledge