Pierre Bleuet

Selenium Segregation in Femtosecond-Laser Hyperdoped Silicon Revealed by Electron Tomography

Doping of silicon with chalcogens (S, Se, Te) by femtosecond laser irradiation to concentrations well above the solubility limit leads to near-unity optical absorptance in the visible and infrared (IR) range and is a promising route toward silicon-based IR optoelectronics. However, open questions remain about the nature of the IR absorptance and in particular about the impact of the dopant distribution and possible role of dopant diffusion. Here we use electron tomography using a high-angle annular dark-field (HAADF) detector in a scanning transmission electron microscope (STEM) to extract information about the three-dimensional distribution of selenium dopants in silicon and correlate these findings with the optical properties of selenium-doped silicon. We quantify the tomography results to extract information about the size distribution and density of selenium precipitates. Our results show correlation between nanoscale distribution of dopants and the observed sub-band gap optical absorptance and demonstrate the feasibility of HAADF-STEM tomography for the investigation of dopant distribution in highly-doped semiconductors.

3D spatial resolution improvement by dual-axis electron tomography: Application to tri-gate transistors

The performance of semiconductor devices can be linked to geometry and variations of the structure. For transistors in particular, the geometry of the gate stack is essential. In this work we investigate the gate stack of a tri-gate transistor using dual-axis electron tomography. This allows the reconstruction of all surfaces of the gate of the transistor with high resolution and measurement of the local thickness of the gate oxide. While previously, dual-axis electron tomography was employed for reducing missing wedge artifacts, our work demonstrates the potential of dual-axis tomography for improving the resolution of a tomographic reconstruction, even for structures not affected by missing wedge artifacts. By simulations and experiments we show the value of dual-axis tomography for characterization of nanoscale devices as an approach that requires no prior information and that can be easily extended even to more than two tilt axes.