Pinyen Lin

Optical add and drop multiplexer using on-chip integration of planar light circuits and optical microelectromechanical system switching

On-chip integration of optical switches and planar light circuits (PLCs) can greatly reduce the size, manufacturing cost, and operating cost of multicomponent optical systems. A silicon-on-insulator platform for integrating microelectromechanical system (MEMS) latching optical waveguide switches with PLCs is presented including a working example of chip scale integration of reconfigurable-optical add/drop multiplexer and λ-Routers, along with details of the integrated latching MEMS optical switches.

Optical MEMS platform for low-cost on-chip integration of planar light circuits and optical switching

Xerox Corporation has developed a technology platform for on-chip integration of latching MEMS optical waveguide switches and Planar Light Circuit (PLC) components using a Silicon On Insulator (SOI) based process. To illustrate the current state of this new technology platform, working prototypes of a Reconfigurable Optical Add/Drop Multiplexer (ROADM) and a l-router will be presented along with details of the integrated latching MEMS optical switches. On-chip integration of optical switches and PLCs can greatly reduce the size, manufacturing cost and operating cost of multi-component optical equipment. It is anticipated that low-cost, low-overhead optical network products will accelerate the migration of functions and services from high-cost long-haul markets to price sensitive markets, including networks for metropolitan areas and fiber to the home. Compared to the more common silica-on-silicon PLC technology, the high index of refraction of silicon waveguides created in the SOI device layer enables miniaturization of optical components, thereby increasing yield and decreasing cost projections. The latching SOI MEMS switches feature moving waveguides, and are advantaged across multiple attributes relative to alternative switching technologies, such as thermal optical switches and polymer switches. The SOI process employed was jointly developed under the auspice of the NIST APT program in partnership with Coventor, Corning IntelliSense Corp., and MicroScan Systems to enable fabrication of a broad range of free space and guided wave MicroOptoElectroMechanical Systems (MOEMS).