Prameela Susarla
General Electric
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Featured researches published by Prameela Susarla.
electronic packaging technology conference | 2005
Ananth Prabhakumar; D. Buckley; Paul Jeffrey Gillespie; S. Mandke; Ryan Rexford Mills; Slawomir Rubinsztajn; Prameela Susarla; Sandeep Tonapi
Due to pending legislation worldwide, the semiconductor packaging industry is switching over to Pb-free electronics assembly. Flip chip packaging, which is one of the fastest growing segments of packaging technology, is also affected by this trend. It is a common practice to underfill flip chip devices to compensate for the coefficient of thermal expansion (CTE) mismatch between the die and the chip carrier. However, compatible underfill materials and processes are necessary for the effective migration of flip chip packaging towards Pb-free. Among the various underfilling techniques used in the industry, the no-flow underfill (NFU) process has the potential to increase throughput and reduce manufacturing costs as stated in D. Gamota and C. Melton (1998). There has been a significant research effort within the industry to develop NFU materials and processes for eutectic applications, but Pb-free reflow temperatures pose a significant challenge to the development of a NFU that is compatible with the Pb-free assembly process. Recently, we have developed a Pb-free compatible NFU material with a combination of self fluxing capability and cure kinetics that allows for successful assembly of 95.5Sn/3.8Ag/0.7Cu bumped flip chip devices. In this paper, the effect of various process variables that affect voiding in the underfill interface is investigated. In addition to these studies, the assembly yields for a Pb-free compatible underfill used to assemble different flip chip components with 95.5Sn/3.8Ag/0.7Cu alloy are discussed
Archive | 2007
Joop Birsak; Herbert Shin-I Chao; Bryan Duffey; Amy Rene Freshour; Hugo Gerard Eduard Ingelbrecht; Qiwei Lu; Michael Joseph O'brien; Prameela Susarla; Michael Alan Vallance; Kenneth Paul Zarnoch
Archive | 2004
John Robert Campbell; Bryan Duffey; John Rude; Prameela Susarla; Michael Alan Vallance; Gary Williams Yeager; Kenneth Paul Zarnoch
Archive | 2006
Qiwei Lu; Michael Joseph O'brien; Prameela Susarla; Michael Alan Vallance
Archive | 2005
Michael Alan Vallance; John Robert Campbell; Kenneth Paul Zarnoch; Prameela Susarla; Bryan Duffey; Gary William Yeager; Michael Joseph O'brien
Archive | 2009
Slawomir Rubinsztajn; Prameela Susarla; Anton Beletskii; Reginald Donovan Smith; Brian David Polizzotti
Archive | 2011
Reginald Donovan Smith; Scott Michael Miller; Yosang Yoon; Slawomir Rubinsztajn; Prameela Susarla
Archive | 2010
Slawomir Rubinsztajn; Reginald Donovan Smith; Evelina Roxana Loghin; Prameela Susarla
Archive | 2011
Scott Michael Miller; Yosang Yoon; Slawomir Rubinsztajn; Peter Kennedy Davis; Prameela Susarla
Archive | 2011
Yosang Yoon; Slawomir Rubinsztajn; Joel Matthew Caraher; Gary Stephen Balch; Prameela Susarla