Rainer Sewald

Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body

Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body

Optoelectronic component comprising a housing body which is metallised in a structured manner, method for producing one such component, and method for the structured metallisation of a body containing plastic

Opto electronic device has a light emitting diode set into a dish space with surface coated with metallised layer to act as a reflector

Method for production of arrangement of optoelectronic components, involves manufacturing two attachment areas on connection carrier and bringing soldering material into attachment areas

Method for producing an arrangement of optoelectronic components, and arrangement of optoelectronic components

Optoelectronic device, method for producing such a device and method for the structural metallization of a body

Arrangement of optoelectronic components

Verfahren zur herstellung einer anordnung optoelektronischer bauelemente und anordnung optoelektronischer bauelemente

Composant optoelectronique comprenant un corps de boitier a metallisation structuree, son procede de production et procede pour la metallisation structuree d'un corps contenant du plastique