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international microwave symposium | 2012

Spintronics-based devices for Microwave Power Harvesting

Simon Hemour; Dimitri Houssameddine; Renu Whig; Jon M. Slaughter; Kerry Nagel; Sanjeev Aggarwal; Yongsheng Gui; C.-M. Hu

Since nearly the beginning, the Schottky diode rules in the development of RF/microwave mixing and rectifying circuits. However, in the specific μW power harvesting applications, the diodes fail to provide satisfying RF-to-DC conversion efficiency mainly due to their high zero-bias junction resistance. This work introduces for the first time a nonlinear component for power rectification based on a recent discovery in spintronics: the spindiode. Along with an analysis of the role of the nonlinearity and the zero bias resistance in the rectification process, it will be shown how the spindiode can provide 10 times more power than a Schottky diode.


23rd Annual International Symposium on Microlithography | 1998

Characterization of oxynitride hard mask removal processes for refractory x-ray mask fabrication

Cameron J. Brooks; Douglas E. Benoit; Kenneth C. Racette; Denise M. Puisto; Renu Whig; William J. Dauksher; Kevin D. Cummings

Silicon oxynitride removal processes are characterized for incorporation into the refractory x-ray mask fabrication sequence as the hardmask removal step. It is essential that his process not alter final image placement, one of the most critical parameters affecting x-ray mask performance. In this paper, we show that 10:1 buffered HF causes large image placement movement when used on refractory x-ray masks. This is because etching in HF has deleterious effects on TaSi, resulting in highly compressive film stress. Materials analysis indicates the presence of hydrogen in the TaSi films after being exposed to HF, which is most likely affecting the film stress. Alternative processes being investigated include using a more dilute 100:1 buffered HF solution and a CHF3 plasma dry-etch chemistry. Both of these options completely remove the SiON hardmask without causing any significant image placement movement and result in high quality refractory x-ray masks.


Archive | 2011

PROCESS INTEGRATION OF A SINGLE CHIP THREE AXIS MAGNETIC FIELD SENSOR

Renu Whig; Phillip Mather; Kenneth H. Smith; Sanjeev Aggarwal; Jon M. Slaughter; Nicholas D. Rizzo


Archive | 1998

Low resistance MTJ

Eugene Chen; Jon M. Slaughter; Renu Whig


Archive | 2012

Spin-torque magnetoresistive memory element and method of fabricating same

Renu Whig; John Slaughter; Nicholas D. Rizzo; Jijun Sun; Frederick B. Mancoff; Dimitri Houssameddine


Archive | 2013

Two-axis magnetic field sensor having reduced compensation angle for zero offset

Jijun Sun; Phillip Mather; Srinivas V. Pietambaram; Jon M. Slaughter; Renu Whig; Nicholas D. Rizzo


Archive | 2000

Method of making a low resistance MTJ

Eugene Chen; Jon M. Slaughter; Renu Whig


Archive | 2013

Apparatus and process for manufacturing ST-MRAM having a metal oxide tunnel barrier

Renu Whig; Jason Allen Janesky; Nicholas D. Rizzo; Jon M. Slaughter; Dimitri Houssameddine


Archive | 2016

Magnetoresistive Memory Element and Method of Fabricating Same

Renu Whig; Jijun Sun; Nicholas D. Rizzo; Jon M. Slaughter; Dimitri Houssameddine; Frederick B. Mancoff


Archive | 2015

Magnetoresistive Structure having a Metal Oxide Tunnel Barrier and Method of Manufacturing Same

Renu Whig; Jason Allen Janesky; Nicholas D. Rizzo; Jon M. Slaughter; Dimitri Houssameddine

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Jijun Sun

Freescale Semiconductor

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