Jon M. Slaughter

Magnetoresistive random access memory using magnetic tunnel junctions

Magnetoresistive random access memory (MRAM) technology combines a spintronic device with standard silicon-based microelectronics to obtain a combination of attributes not found in any other memory technology. Key attributes of MRAM technology are nonvolatility and unlimited read and write endurance. Magnetic tunnel junction (MTJ) devices have several advantages over other magnetoresistive devices for use in MRAM cells, such as a large signal for the read operation and a resistance that can be tailored to the circuit. Due to these attributes, MTJ MRAM can operate at high speed and is expected to have competitive densities when commercialized. In this paper, we review our recent progress in the development of MTJ-MRAM technology. We describe how the memory operates, including significant aspects of reading, writing, and integration of the magnetic material with CMOS, which enabled our recent demonstration of a 1-Mbit memory chip. Important memory attributes are compared between MRAM and other memory technologies.

Progress and outlook for MRAM technology

We summarize the features of existing semiconductor memories and compare them to Magnetoresistive Random Access Memory (MRAM),a semiconductor memory with magnetic bits for nonvolatile storage. MRAM architectures based on Giant Magnetoresistance (GMR) and Magnetic Tunnel Junction (MTJ) cells are described. This paper will discuss our progress on improving the material structures, memory bits, thermal stability of the bits, and competitive architectures for GMR and MTJ based MRAM memories as well as the potential of these memories in the commercial memory market.

A 1-Mbit MRAM based on 1T1MTJ bit cell integrated with copper interconnects

A low-power 1-Mb magnetoresistive random access memory (MRAM) based on a one-transistor and one-magnetic tunnel junction (1T1MTJ) bit cell is demonstrated. This is the largest MRAM memory demonstration to date. In this circuit, the magnetic tunnel junction (MTJ) elements are integrated with CMOS using copper interconnect technology. The copper interconnects are cladded with a high-permeability layer which is used to focus magnetic flux generated by current flowing through the lines toward the MTJ devices and reduce the power needed for programming. The 25-mm/sup 2/ 1-Mb MRAM circuit operates with address access times of less than 50 ns, consuming 24 mW at 3.0 V and 20 MHz. The 1-Mb MRAM circuit is fabricated in a 0.6-/spl mu/m CMOS process utilizing five layers of metal and two layers of poly.

High density submicron magnetoresistive random access memory (invited)

Various giant magnetoresistance material structures were patterned and studied for their potential as memory elements. The preferred memory element, based on pseudo-spin valve structures, was designed with two magnetic stacks (NiFeCo/CoFe) of different thickness with Cu as an interlayer. The difference in thickness results in dissimilar switching fields due to the shape anisotropy at deep submicron dimensions. It was found that a lower switching current can be achieved when the bits have a word line that wraps around the bit 1.5 times. Submicron memory elements integrated with complementary metal–oxide–semiconductor (CMOS) transistors maintained their characteristics and no degradation to the CMOS devices was observed. Selectivity between memory elements in high-density arrays was demonstrated.

The science and technology of magnetoresistive tunneling memory

Rapid advances in portable communication and computing systems are creating an increasing demand for nonvolatile random access memory that is both high-density and highspeed. Existing solid-state technologies are unable to provide all of the needed attributes in a single memory solution. Therefore, a number of different memories are currently being used to achieve the multiple functionality requirements, often compromising performance and adding cost to the system. A new technology, magnetoresistive random access memory (MRAM) based on magnetoresistive tunneling, has the potential to replace these memories in various systems with a single, universal solution. The key attributes of MRAM are nonvolatility, high-speed operation. and unlimited read and write endurance. This technology is enabled by the ability to deposit high-quality, nanometer scale tunneling barriers that display enhanced magnetoresistive response. In this article we describe several fundamental technical and scientific aspects of MRAM with emphasis on recent accomplishments that enabled our successful demonstration of a 256-Kb memory chip.

Thermally activated magnetization reversal in submicron magnetic tunnel junctions for magnetoresistive random access memory

We have measured thermally activated magnetization reversal of the free layers in submicron magnetic tunnel junctions to be used for magnetoresistive random access memory. We applied magnetic field pulses to the bits with a pulse duration tp ranging from nanoseconds to 0.1 ms. We have measured the switching probability as a function of tp with a fixed field amplitude H, and as a function of H for fixed tp. For both cases, we find good agreement with the switching probability predicted by the Arrhenius–Neel theory for thermal activation over a single energy barrier.

A low power 1 Mbit MRAM based on 1T1MTJ bit cell integrated with copper interconnects

A low power 1 Mb Magnetoresistive Random Access Memory (MRAM) based on a 1-Transistor and 1-Magnetic Tunnel Junction (1T1MTJ) bit cell is demonstrated. This is the largest MRAM memory demonstration to date. In this circuit, MTJ elements are integrated with CMOS using copper interconnect technology. The copper interconnects are cladded with a high permeability layer which is used to focus magnetic flux generated by current flowing through the lines toward the MTJ devices and reduce the power needed for programming the bits. The 25 mm/sup 2/ 1 Mb MRAM circuit operates with address access times of less than 50 ns, consuming 24 mW at 3.0 V and 20 MHz. The circuit is fabricated in a 0.6 /spl mu/m CMOS process utilizing five layers of metal and two layers of poly.

Survey of Ti-, B-, and Y-based soft x-ray–extreme ultraviolet multilayer mirrors for the 2- to 12-nm wavelength region

We have performed an experimental investigation of Ti-, B(4)C-, B-, and Y-based multilayer mirrors for the soft x-ray¿extreme ultraviolet (XUV) wavelength region between 2.0 and 12.0 nm. Eleven different material pairs were studied: Ti/Ni, Ti/Co, Ti/Cu, Ti/W, B(4)C/Pd, B/Mo, Y/Pd, Y/Ag, Y/Mo, Y/Nb, and Y/C. The multilayers were sputter deposited and were characterized with a number of techniques, including low-angle x-ray diffraction and normal incidence XUV reflectometry. Among the Ti-based multilayers the best results were obtained with Ti/W, with peak reflectances up to 5.2% at 2.79 nm at 61° from normal incidence. The B(4)C/Pd and B/Mo multilayer mirrors had near-normal incidence (5°) peak reflectances of 11.5% at 8.46 nm and 9.4% at 6.67 nm, respectively, whereas a Y/Mo multilayer mirror had a maximum peak reflectance of 25.6% at 11.30 nm at the same angle. The factors limiting the peak reflectance of these different multilayer mirrors are discussed.

Structure and performance of Si/Mo multilayer mirrors for the extreme ultraviolet

We report the results of structural, chemical, and extreme ultraviolet (EUV) characterization of Si/Mo multilayers grown by sputtering and by UHV evaporation. This study includes mirrors designed for normal incidence with peak reflectivities Rpeak between 22 and 24 nm, and 45° mirrors having Rpeak between 16 and 19 nm. The deposition conditions were varied to produce multilayers with a wide range of interface morphologies. A variety of techniques were used to determine the structure and composition of the multilayers, including x‐ray diffraction, transmission electron microscopy, Rutherford backscattering spectroscopy, and Auger depth profiling. All of the mirrors have amorphous Si layers and polycrystalline Mo layers with thin amorphous alloy interlayers. We obtain good fits to the low‐angle x‐ray diffraction data only when these interlayers are taken into account. The best sputter‐deposited mirrors were made at the lowest Ar pressure studied, 3 mTorr. The best evaporated mirrors were produced at a subst...

Comparison of oxidation methods for magnetic tunnel junction material

Advances in reducing the resistance and enhancing the magnetoresistance (MR%) of the magnetic tunnel junction (MTJ) material has made it useful for magnetoresistive random access memory as well as magnetic field sensing applications. One of the most important aspects for producing the MTJ material is the method used for forming the tunnel barrier, and its impact on the properties of MTJ such as resistance and area product (RA), MR%, and RA uniformity across a large area. We have explored forming the aluminum oxide tunnel barrier with air; reactive sputtering; plasma oxidation with plasma source; plasma oxidation with power introduced from the target side; and plasma oxidation with power introduced from the substrate side. Our results show that all techniques can be made to work. Plasma oxidation is favored due to its simplicity and manufacturing compatibility. It was also discovered that different oxidation methods used in this study caused little difference in MTJ resistance uniformity. The latter is mai...