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Richard Benton Booth

IBM

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Publication

Featured researches published by Richard Benton Booth.

Archive | 1993

Parallel process interposer (PPI)

Richard Benton Booth; Robert H. Gephard; Bradley S. Gremban; Janet E. Poetzinger; David Tjeng-Ming Shen

Archive | 1996

Direct chip attachment (DCA) with electrically conductive adhesives

Richard Benton Booth; Michael A. Gaynes; Robert M. Murco; Viswanadham Puligandla; Judith Marie Roldan; Ravi F. Saraf; Jerzy M. Zalesinski

Archive | 1992

Liquid metal matrix thermal paste

Richard Benton Booth; Gary W. Grube; Peter A. Gruber; Igor Y. Khandros; Arthur R. Zingher

Archive | 1989

Compliant thermally conductive compound

Herbert Rudolph Anderson; Richard Benton Booth; Lawrence Daniel David; Mark O. Neisser; Harbans S. Sachdev; Mark Anthony Takacs

Archive | 1993

Method of fabricating a multi-layer integrated circuit chip interposer

Richard Benton Booth; Robert H. Gephard; Bradley S. Gremban; Janet E. Poetzinger; David Tjeng-Ming Shen

Archive | 1994

Method for replacing IC chip package interposer

Richard Benton Booth; Robert H. Gephard; Bradley S. Gremban; Janet E. Poetzinger; David Tjeng-Ming Shen

Archive | 1994

Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess

Richard Benton Booth; Emanuel I. Cooper; E. A. Giess; Mark R. Kordus; Sol Krongelb; Steven P. Ostrander; Judith Marie Roldan; Carlos Juan Sambucetti; Ravi F. Saraf

Archive | 1998

Lead free conductive composites for electrical interconnections

Ravi F. Saraf; Judith Marie Roldan; Michael A. Gaynes; Richard Benton Booth; Steven P. Ostrander; Emanuel I. Cooper; Carlos Juan Sambucetti

Archive | 1991

Process for making a compliant thermally conductive compound

Herbert Rudolph Anderson; Richard Benton Booth; Lawrence Daniel David; Mark O. Neisser; Harbans S. Sachdev; Mark Anthony Takacs

Archive | 1997

Electrically conductive paste and composite and their use as an electrically conductive connector

Ravi F. Saraf; Judith Marie Roldan; Michael A. Gaynes; Richard Benton Booth; Stephen Paul Ostrander; Emanuel I. Cooper; Carlos Juan Sambucetti

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Collaboration

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Herbert Rudolph Anderson

IBM

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Lawrence Daniel David

IBM

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Mark Anthony Takacs

IBM

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Mark O. Neisser

IBM

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Harbans Singh Sachdev

Harvard University

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Ravi F. Saraf

University of Nebraska–Lincoln

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Judith Marie Roldan

IBM

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Bradley S. Gremban

IBM

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Carlos Juan Sambucetti

IBM

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David Tjeng-Ming Shen

IBM

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