Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Mark Anthony Takacs is active.

Publication


Featured researches published by Mark Anthony Takacs.


electronic components and technology conference | 1996

Reliability and characterization of MLC decoupling capacitors with C4 interconnections

Donald W. Scheider; Donald Hopkins; Paul Zucco; Edward Moszczynski; Michael Griffin; Mark Anthony Takacs; John Galvagni

Multilayer ceramic (MLC) capacitors are composite structures made of alternating layers of ceramic (dielectric material) and metal (electrodes). The dielectric material is barium titanate-based ceramic and the electrodes are made of platinum. C4 (controlled collapse chip connections) technology is used to provide multiple attachment points to substrates. A high dielectric constant of barium titanate-based ceramic helps to achieve a large capacitance/size ratio. The capacitance ranges from 32 nF to 100 nF in body sizes up to 1.85/spl times/1.6/spl times/0.85 mm. In this paper, we cover design, reliability and electrical characterization of capacitors with C4 interconnections. Reliability stress tests performed during qualification were designed to cover a wide range of field applications and included stress tests such as liquid to liquid thermal shock, moisture resistance and thermal cycles per Mil.Std., high temperature bias, temperature humidity bias and tensile pull. A visual inspection of parts post stress and physical analysis of unstressed parts were also performed. The parameters monitored during stress testing were: capacitance, leakage current and plate resistance. The electrical characterization measurements included effects of frequency, temperature and voltage. Inductance measurements were included based on a self-resonance technique.


Archive | 1997

Process of forming a capacitor with multi-level interconnection technology

Hormazdyar M. Dalal; Gene Joseph Gaudenzi; Rebecca Y. Gorrell; Mark Anthony Takacs; Kenneth J. Travis


Archive | 1989

Compliant thermally conductive compound

Herbert Rudolph Anderson; Richard Benton Booth; Lawrence Daniel David; Mark O. Neisser; Harbans S. Sachdev; Mark Anthony Takacs


Archive | 2002

Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate

Bruce Anthony Copeland; Rebecca Y. Gorrell; Mark Anthony Takacs; Kenneth J. Travis; Jun Wang; Lovell B. Wiggins


Archive | 1985

Planarization process for organic filling of deep trenches

Nancy Rebecca Cservak; Susan Kay Fribley; George Richard Goth; Mark Anthony Takacs


Archive | 1984

Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials

Constance Joan Araps; Steven M. Kandetzke; Ellen Lois Kutner; Mark Anthony Takacs


Archive | 1990

Low dielectric composite substrate

John Acocella; Arnold I. Baise; Richard A. Bates; Jon A. Casey; David R. Clarke; Renuka Shastri Divakaruni; James N. Humenik; Steven M. Kandetzke; Daniel Patrick Kirby; John U. Knickerbocker; Sarah H. Knickerbocker; Amy T. Matts; Robert Wolff Nufer; Srinivasa S. N. Reddy; Mark Anthony Takacs; Lovell B. Wiggins


Archive | 1997

Capacitor with multi-level interconnection technology

Hormazdyar M. Dalal; Gene Joseph Gaudenzi; Rebecca Y. Gorrell; Mark Anthony Takacs; Kenneth J. Travis


Archive | 1992

Process for fabricating a low dielectric composite substrate

John Acocella; Peter A. Agostino; Arnold I. Baise; Richard A. Bates; Ray Bryant; Jon A. Casey; David R. Clarke; George Czornyj; Allen J. Dam; Lawrence Daniel David; Renuka Shastri Divakaruni; Werner Ernest Dunkel; Ajay P. Giri; Liang-Choo Hsia; James N. Humenik; Steven M. Kandetzke; Daniel Patrick Kirby; John U. Knickerbocker; Sarah H. Knickerbocker; Anthony Mastreani; Amy T. Matts; Robert Wolff Nufer; Charles Hampton Perry; Srinivasa S. N. Reddy; Salvatore James Scilla; Mark Anthony Takacs; Lovell B. Wiggins


Archive | 1986

Method for forming a film of dielectric material on an electric component

Constance Joan Araps; Steven M. Kandetzke; Mark Anthony Takacs

Researchain Logo
Decentralizing Knowledge