Richard J. Webb | Researchain

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Featured researches published by Richard J. Webb.

Archive | 1996

Method of modifying an exposed surface of a semiconductor wafer

Wesley J. Bruxvoort; Scott R. Culler; Kwok-Lun Ho; David A. Kaisaki; Carl R. Kessel; Thomas P. Klun; Heather K. Kranz; Robert P. Messner; Richard J. Webb; Julia P. Williams

Archive | 1997

Abrasive construction for semiconductor wafer modification

Denise R. Rutherford; Douglas P. Goetz; Cristina U. Thomas; Richard J. Webb; Wesley J. Bruxvoort; James D. Buhler; William J. Hollywood

Archive | 1992

Abrasive article having abrasive composite members positioned in recesses

Wesley J. Bruxvoort; Clyde D. Calhoun; Richard J. Webb

Archive | 2002

Abrasive article having a window system for polishing wafers, and methods

Michael J. Muilenburg; Chong-Yong J. Kim; Jerry J. Fizel; Richard J. Webb; John J. Gagliardi; Daniel B. Pendergrass; Robert J. Streifel; Wesley J. Bruxvoort

Archive | 2006

Method of polishing a wafer

Richard J. Webb; John C. Clark; Christopher J. Saint Paul Rueb; John J. Gagliardi

Archive | 2008

Method for manufacturing thin substrate using a laminate body

Carl R. Kessel; Larry D. Boardman; Richard J. Webb

Archive | 2006

Laminate body, and method for manufacturing thin substrate using the laminate body

Carl R. Kessel; Larry D. Boardman; Richard J. Webb

Archive | 2002

Fixed Abrasives and Selective Chemistries: Some Real Advantages for Direct STI CMP

John J. Gagliardi; Richard J. Webb; Chris Rueb; Greg Menk; Pete McReynolds; Gopal Prabhu; Tom Osterheld

Archive | 2005

Wafer planarization composition and method of use

Christopher J. Rueb; Richard J. Webb; Bhaskar V. Velamakanni

Archive | 1996

Method of modifying a surface of a semiconductor wafer

Wesley J. Bruxvoort; Scott R. Culler; Kwok-Lun Ho; David A. Kaisaki; David A. Kessel; Thomas P. Klun; Heather K. Kranz; Robert P. Messner; Richard J. Webb; Julia P. Williams

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