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Richard William Noth

IBM

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Publication

Featured researches published by Richard William Noth.

Archive | 1990

Integrated semiconductor chip package

Kurt Hinrichsmeyer; Werner Straehle; Gordon Arthur Kelley; Richard William Noth

Archive | 1991

Lead frame-chip package with improved configuration

Gow rd John; Richard William Noth

Archive | 1991

High performance versatile thermally enhanced IC chip mounting

Gow rd John; Richard William Noth

Archive | 1990

Tape bonded semiconductor device.

James Andrew Bilowith; Edward John Dombroski; William H. Guthrie; Richard William Noth

Archive | 1993

Compliant lead for surface mounting a chip package to a substrate

Herman Sol Hoffman; Richard William Noth

Archive | 1980

Method of sealing an electronic module in a cap

Floyd Richard Moser; Richard William Noth

Archive | 1968

Gelation coating method for electronic circuit panels

John Burke Chamberlin; Richard William Noth

Archive | 1981

Method of sealing an electronic module

Floyd Richard Moser; Richard William Noth

Archive | 1970

Verfahren zur Herstellung eines dünnen, gleichmässigen Überzugs auf einem Träger, insbesondere für elektronische Schaltungen

John Burke Chamberlin; Richard William Noth

Archive | 1994

Elastische Leitung zur Oberflächenmontage einer Chippackung auf einem Substrat

Herman Sol Hoffman; Richard William Noth

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Gordon Arthur Kelley

IBM

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Herman Sol Hoffman

IBM

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Kurt Hinrichsmeyer

IBM

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Werner Straehle

IBM

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Floyd Richard Moser

IBM

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Gow rd John

IBM

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John Burke Chamberlin

IBM

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Edward John Dombroski

IBM

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James Andrew Bilowith

IBM

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William H. Guthrie

IBM

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