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Dive into the research topics where Gordon Arthur Kelley is active.

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Featured researches published by Gordon Arthur Kelley.


IEEE Journal of Solid-state Circuits | 1990

A 50-ns 16-Mb DRAM with a 10-ns data rate and on-chip ECC

Howard Leo Kalter; Charles H. Stapper; John E. Barth; J. DiLorenzo; C.E. Drake; John A. Fifield; Gordon Arthur Kelley; S.C. Lewis; W.B. van der Hoeven; J.A. Yankosky

A high-speed 16-Mb DRAM chip with on-chip error-correcting code (ECC), which supports either 11/11 or 12/0 RAS/CAS addressing and operates on a 3.3- or 5-V power supply, is described. It can be packaged as a 2-Mb*8, 4-Mb*4, 8-Mb*2, or 16-Mb*1 DRAM, And is capable of operating in fast page mode, static column mode, or toggle mode. Speed and flexibility are achieved by a pipeline layout and on-chip SRAMs that buffer entire ECC words. The use of redundant word and bit lines in conjunction with the ECC produces a synergistic fault-tolerance effect. >


international solid-state circuits conference | 1990

A 50 ns 16 Mb DRAM with a 10 ns data rate

Howard Leo Kalter; John E. Barth; J. Dilorenzo; Charles Edward Drake; John A. Fifield; William Paul Hovis; Gordon Arthur Kelley; Scott C. Lewis; J. Nickel; Charles H. Stapper; James Andrew Yankosky

A 16-Mb DRAM chip fabricated in a 0.5- mu m CMOS process using silicided polysilicon, double metal, and trench storage is described. It incorporates an architecture that supports either 11/11 or 12/10 RAS/CAS (row-address strobe/column-address-strobe) addressing. It is segmented to utilize bit redundancy of 2 lines/137-b lines/half quadrant, and separate word-redundant array of 24 lines/quadrant, providing any-for-any-word-line replacement within a quadrant. It has single-error-correct/double-error-detect (SEC/DED) error checking and correcting (ECC) Hamming odd-weight code/quadrant and either 5-V or 3-V operation. The design provides a RAS access of 50 ns with 16-ns fast-page access, 18-ns static column or toggle of 10 ns at 2.9 V and 85 degrees C. DRAM features are summarized.<<ETX>>


Archive | 1990

Integrated semiconductor chip package

Kurt Hinrichsmeyer; Werner Straehle; Gordon Arthur Kelley; Richard William Noth


Archive | 1992

Three dimensional multichip package methods of fabrication

Claude L. Bertin; Paul Alden Farrar; Howard Leo Kalter; Gordon Arthur Kelley; Willem B. van der Hoeven; Francis Roger White


Archive | 1991

Three-dimensional multichip packages and methods of fabrication

Claude L. Bertin; Paul Alden Farrar; Howard Leo Kalter; Gordon Arthur Kelley; Willem B. van der Hoeven; Francis Roger White


Archive | 1993

Integrated multichip memory module structure

Claude L. Bertin; Wayne J. Howell; Erik L. Hedberg; Howard K. Kalter; Gordon Arthur Kelley


Archive | 1993

Integrated memory cube structure

Claude L. Bertin; Wayne J. Howell; Erik L. Hedberg; Howard Leo Kalter; Gordon Arthur Kelley


Archive | 1994

Integrated mulitchip memory module, structure and fabrication

Claude L. Bertin; Wayne J. Howell; Erik L. Hedberg; Howard Leo Kalter; Gordon Arthur Kelley


Archive | 1994

Integrated memory cube, structure and fabrication

Claude L. Bertin; Wayne J. Howell; Erik L. Hedberg; Howard Leo Kalter; Gordon Arthur Kelley


Archive | 1993

Multichip integrated circuit packages and systems

Kenneth E. Beilstein; Claude L. Bertin; Howard Leo Kalter; Gordon Arthur Kelley; Christopher P. Miller; Dale E. Pontius; Willem B. van der Hoeven; Steven Platt

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