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Dive into the research topics where Russell S. Peak is active.

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Featured researches published by Russell S. Peak.


Engineering With Computers | 1998

Integrating Engineering Design and Analysis Using a Multi-Representation Approach †

Russell S. Peak; Robert E. Fulton; Ichirou Nishigaki; Noriaki Okamoto

With the present gap between CAD and CAE, designers are often hindere in their efforts to explore design alternatives and ensure product robustness. This paper describes the multi-representation architecture (MRA)—a design-analysis integration strategy that views CAD-CAE integration as an information-intensive mapping between design models and analysis models. The MRA divides this mapping into subproblems using four information representations: solution method models (SMMs), analysis building blocks (ABBs), product models (PMs), and product model-based analysis models (PBAMs). A key distinction is the explicit representation of design-analysis associativity as PM-ABB idealization linkages that are contained in PBAMs.The MRA achieves flexibility by supporting different solution tools and design tools, and by accommodating analysis models of diverse discipline, complexity and solution method. Object and constraint graph techniques provide modularity and rich semantics.Priority has been given to the class of problems termedroutine analysis—the regular use of established analysis models in product design. Representative solder joint fatigue case studies demonstrate that the MRA enables highly automated routine analysis for mixed formula-based and finite element-based models. Accordingly, one can employ the MRA and associated methodology to create specialized CAE tools that utilize both design information and general purpose solution tools.


Journal of Computing and Information Science in Engineering | 2005

Streamlining Product Lifecycle Processes: A Survey of Product Lifecycle Management Implementations, Directions, and Challenges

Ravi Rangan; Steve M. Rohde; Russell S. Peak; Bipin Chadha; Plamen Bliznakov

The past three decades have seen phenomenal growth in investments in the area of product lifecycle management (PLM) as companies exploit opportunities in streamlining product lifecycle processes, and fully harnessing their data assets. These processes span all product lifecycle phases from requirements definition, systems design/ analysis, and simulation, detailed design, manufacturing planning, production planning, quality management, customer support, in-service management, and end-of-life recycling. Initiatives ranging from process re-engineering, enterprise-level change management, standardization, globalization and the like have moved PLM processes to mission-critical enterprise systems. Product data representations that encapsulate semantics to support product data exchange and PLM collaboration processes have driven several standards organizations, vendor product development efforts, real-world PLM implementations, and research initiatives. However, the process and deployment dimensions have attracted little attention: The need to optimize organization processes rather than individual benefits poses challenging “culture change management” issues and have derailed many enterprise-scale PLM efforts. Drawn from the authors’ field experiences as PLM system integrators, business process consultants, corporate executives, vendors, and academicians, this paper explores the broad scope of PLM, with an added focus on the implementation and deployment of PLM beyond the development of technology. We review the historical evolution of engineering information management/PLM systems and processes, characterize PLM implementations and solution contexts, and discuss case studies from multiple industries. We conclude with a discussion of research issues motivated by improving PLM adoption in industry.


Computers in Entertainment | 2004

A KNOWLEDGE REPOSITORY FOR BEHAVIORAL MODELS IN ENGINEERING DESIGN

Gregory Mocko; Richard J. Malak; Christiaan J.J. Paredis; Russell S. Peak

Computer simulations and behavioral modeling are becoming increasingly important in product development processes. Simulations can result in better decisions in less time by providing the designers with greater understanding of the product’s behavior. However, behavior model creators (i.e. analysts) and behavior model users (i.e. designers) often do not have the same level of understanding of the model, thus limiting the reuse of a model. Our goal in this research is to develop a clean interface that reduces the knowledge gap between engineering design and analysis by facilitating reuse of behavioral models. To achieve a higher level of reuse in the product design process, we propose a meta-data representation for formally characterizing behavioral models. The meta-data representation captures the assumptions, limitations, accuracy, and context of engineering behavioral models. Based on this knowledge representation, a proof-of-concept repository is implemented for archiving and exchanging reusable behavioral models. The knowledge representation and implementation is illustrated with a simple cantilever beam example.


ieee aerospace conference | 2011

SLIM: collaborative model-based systems engineering workspace for next-generation complex systems

Manas Bajaj; Dirk Zwemer; Russell S. Peak; Alex Phung; Andrew Scott; Miyako Wilson

Development of complex systems is a collaborative effort spanning disciplines, teams, processes, software tools, and modeling formalisms. It is the vision of model-based systems engineering (MBSE) to enable a consistent, coherent, interoperable, and evolving model of a system throughout its lifecycle. However, no currently available modeling language can represent all aspects of a system (including system-of-systems) at all levels of abstraction across the lifecycle.


ASME 2003 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference | 2003

Characterizing Fine-Grained Associativity Gaps: A Preliminary Study of CAD-CAE Model Interoperability

Russell S. Peak

This paper describes an initial study towards characterizing model associativity gaps and other engineering interoperability problems. Drawing on over a decade of X-analysis integration (XAI) 1 research and development, it uses the XAI multirepresentation architecture (MRA) as a means to decompose the problem and guide identification of potential key metrics. A few such metrics are highlighted from the aerospace industry. These include number of structural analysis users, number of analysis templates, and identification of computing environment components (e.g., number of CAD and CAE tools used in an example aerospace electronics design environment). One problem, denoted the fine-grained associativity gap, is highlighted in particular. Today such a gap in the CAD-CAE arena typically requires manual effort to connect an attribute in a design model (CAD) with attributes in one of its analysis models (CAE). This paper estimates that 1 million such gaps exist in the structural analysis of a complex product like an airframe. The labor cost alone to manually maintain such gaps likely runs in the tens of millions of dollars. Other associativity gap costs have yet to be estimated, including over- and underdesign, lack of knowledge capture, and inconsistencies. Narrowing in on fundamental gaps like fine-grained associativity helps both to characterize the cost of today’s problems and to identify basic solution needs. Other studies are recommended to explore such facets further.


INCOSE International Symposium | 2011

4.3.1 Satellites to Supply Chains, Energy to Finance —SLIM for Model-Based Systems Engineering

Manas Bajaj; Dirk Zwemer; Russell S. Peak; Alex Phung; Andrew Scott; Miyako Wilson

Development of complex systems is a collaborative effort spanning disciplines, teams, processes, software tools, and modeling formalisms. Increasing system complexity, reduction in available resources, globalized and competitive supply chains, and volatile market forces necessitate that a unified model-based systems engineering environment replace ad-hoc, document-centric and point-to-point environments in organizations developing complex systems. To address this challenge, we envision SLIM—a collaborative, model-based systems engineering workspace for realizing next-generation complex systems. SLIM uses SysML to represent the front-end conceptual abstraction of a system that can “co-evolve” with the underlying fine-grained connections to models in discipline-specific tools and standards. With SLIM, system engineers can drive automated requirements verification, system simulations, trade studies and optimization, risk analyses, design reviews, system verification and validation, and other key systems engineering tasks from the earliest stages of development directly from the SysML-based system model. SLIM provides analysis tools that are independent of any systems engineering methodology, and integration tools that connect SysML with a wide variety of COTS and in-house design and simulation tools. We are presenting SLIM and its applications in two papers. In Part 1 (this paper), we present the motivation and challenges that led to SLIM. We describe the conceptual architecture (section 1) and use cases (section 2) of SLIM followed by tools available for production and evaluation usage (section 3). In Part 2 paper—SLIM Applications—we present the applications of SLIM tools to a variety of domains, both in traditional as well as non-traditional domains of systems engineering. Representative examples from space, energy, infrastructure, manufacturing and supply chain, military operations, and bank systems are presented. * Corresponding author: Manas Bajaj, [email protected], phone: +1-404-592-6897. Preferred citation: Bajaj, M., Zwemer, D., Peak, R., Phung, A., Scott, A. and Wilson, M. (2011). Satellites to Supply Chains, Energy to Finance — SLIM for Model-Based Systems Engineering, Part 1: Motivation and Concept of SLIM. 21st Annual INCOSE International Symposium, Denver, CO, June 20-23, 2011.


Engineering With Computers | 2008

ZAP: a knowledge-based FEA modeling method for highly coupled variable topology multi-body problems

Sai Zeng; Russell S. Peak; Angran Xiao; Suresh K. Sitaraman

Some of the most significant challenges in automated CAD–FEA integration are information and model transformations between CAD and FEA tools. These are especially labor-intensive and time-consuming in a newly characterized class of problems termed highly coupled variable topology multi-body (HCVTMB) problems. This paper addresses these challenges with a knowledge-based FEA modeling method called ZAP that consists of three stepping-stone information models and the mapping processes between these models. The information and knowledge of a typical FEA modeling process are explicitly captured in semantically rich information models to achieve benefits including knowledge sharing, system extension, and model modification. ZAP mapping processes automatically transform abstract analytical concepts into tool-specific commands and functions that accomplish HCVTMB model generation and solution management. This method enhances flexibility and reusability in FEA modeling and enables CAD–FEA integration at the knowledge level. To demonstrate the efficacy of ZAP, we overview a sample HCVTMB problem—an electronic chip package plastic ball grid array (PBGA) thermal analysis case study. Experience indicates that ZAP increases knowledge capture and decreases modeling time from days/hours to hours/minutes compared to conventional methods, thus providing a key enabler toward design optimization.


5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the | 2004

PWB warpage analysis and verification using an AP210 standards-based engineering framework and shadow moire

Dirk Zwemer; Manas Bajaj; Russell S. Peak; Thomas Thurman; Kevin G. Brady; S. McCarron; A. Spradling; Mike Dickerson; Lothar Klein; Giedrius Liutkus; John V. Messina

Thermally induced warpage of printed wiring boards (PWB) and printed wiring assemblies (PWAs) is an increasingly important issue in managing the manufacturing yield and reliability of electronic devices. In this paper, we introduce complementary simulation and experimental verification procedures capable of investigating warpage at the local feature level as well as the global PWB level. Simulation within a standards-based engineering framework allows efficient introduction of detailed feature information into warpage models of varying fidelity. Experimental results derived from temperature-dependent shadow moire provide a rapid high resolution picture of local warpage in critical regions. We describe initial results for two unpopulated PWB test cases which indicate a promising outlook for the methodology.


international electronics manufacturing technology symposium | 2003

Towards next-generation design-for-manufacturability (DFM) frameworks for electronics product realization

Manas Bajaj; Russell S. Peak; Miyako Wilson; Injoong Kim; Thomas Thurman; M. C. Jothishankar; Mike Benda; Placid M. Ferreira; James A. Stori

This paper elucidates the process architecture of a pilot implementation of a DFM Framework (specifically the SFM DFM Framework or SDF), which consists of four key ingredients. The first ingredient is a Design Integrator that acquires product design information from an ECAD tool and in-house sources (each populating a subset of the design) and consolidates them into a STEP AP210 model. The second ingredient is a Rule-based Expert System (initiated at Boeing) that captures the manufacturability constraints as DFM rules and evaluates printed circuit assembly (PCA) designs against them. The third ingredient is a Design View Generator that extracts design information from the AP210 model (first ingredient) and library database and derives a Kappa design model for the expert system (second ingredient) to evaluate. The fourth ingredient is the Results Viewer that helps the user browse DFM analysis results and identify design improvement opportunities. This implementation of the SDF demonstrates the ability to extract PCA design information and build a higher fidelity standards-based design model. Additionally, it also shows the capability of Rule-based Expert Systems to emulate manufacturability checks on product (PCAs in this case) designs as well as increase analysis coverage and reduce human checking time via automation.


INCOSE International Symposium | 2011

4.3.3 Satellites to Supply Chains, Energy to Finance -SLIM for Model-Based Systems Engineering: Part 2: Applications of SLIM

Manas Bajaj; Dirk Zwemer; Russell S. Peak; Alex Phung; Andrew Scott; Miyako Wilson

Development of complex systems is a collaborative effort spanning disciplines, teams, processes, software tools, and modeling formalisms. Increasing system complexity, reduction in available resources, globalized and competitive supply chains, and volatile market forces necessitate that a unified model-based systems engineering environment replace ad-hoc, document-centric and point-to-point environments in organizations developing complex systems. To address this challenge, we envision SLIM—a collaborative, model-based systems engineering workspace for realizing next-generation complex systems. SLIM uses SysML to represent the front-end conceptual abstraction of a system that can “co-evolve” with the underlying fine-grained connections to models in discipline-specific tools and standards. With SLIM, system engineers can drive automated requirements verification, system simulations, trade studies and optimization, risk analyses, design reviews, system verification and validation, and other key systems engineering tasks from the earliest stages of development directly from the SysML-based system model. SLIM provides analysis tools that are independent of any systems engineering methodology, and integration tools that connect SysML with a wide variety of COTS and in-house design and simulation tools. We are presenting SLIM and its applications in two papers. In Part 1 paper—Motivation and Concept of SLIM—we presented the motivation and challenges that led to SLIM, the conceptual architecture of SLIM, and SLIM tools available for production and evaluation usage. In Part 2 (this paper), we present the applications of SLIM tools to a variety of domains, both in traditional as well as non-traditional domains of systems engineering. Representative SysML models and results of trade studies, risk analysis, and other system engineering tasks performed using SLIM tools are presented for the following domains—space systems, energy systems, infrastructure systems, manufacturing and supply chain systems, military operations, and bank systems. * Corresponding author: Manas Bajaj, [email protected], phone: +1-404-592-6897. Preferred citation: Bajaj, M., Zwemer, D., Peak, R., Phung, A., Scott, A. and Wilson, M. (2011). Satellites to Supply Chains, Energy to Finance — SLIM for Model-Based Systems Engineering, Part 1: Motivation and Concept of SLIM. 21st Annual INCOSE International Symposium, Denver, CO, June 20-23, 2011.

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Manas Bajaj

Georgia Institute of Technology

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Miyako Wilson

Georgia Institute of Technology

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Robert E. Fulton

Georgia Institute of Technology

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Injoong Kim

Georgia Institute of Technology

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Sai Zeng

Georgia Institute of Technology

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Andrew J. Scholand

Georgia Institute of Technology

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Angran Xiao

Georgia Institute of Technology

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Suresh K. Sitaraman

Georgia Institute of Technology

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Christiaan J.J. Paredis

Georgia Institute of Technology

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