Saikumar Jayaraman
Intel
Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Saikumar Jayaraman.
international conference on electronic packaging technology | 2010
Jieping Zhang; Marcus Hsu; Saikumar Jayaraman
Cure Induced Micro-Anomaly (CIMA) are worm like hollow microstructures found within resin rich region of underfill after curing within a BGA package with combination of copper die bumps and Sn-Ag substrate bumps. CIMA leads to solder extrusion during secondary reflow. Root cause of CIMA has been identified to be from thermal mechanical stress induced by the stiffness of the joints formed between the die and substrate, dissipation of stress causes the underfill to crack. Addition of stress induction from package warpage, high Prebake temperature has shown to worsen effects of CIMA. Step-cure and flip curing has shown to reduce the effects.
Archive | 2001
Ashay A. Dani; Paul A. Koning; Saikumar Jayaraman; Christopher L. Rumer
Archive | 2007
Saikumar Jayaraman; Paul A. Koning; Ashay A. Dani
Archive | 2002
Christopher L. Rumer; Sabina J. Houle; Saikumar Jayaraman; Paul A. Koning; Ashay A. Dani
Archive | 2011
Saikumar Jayaraman; Paul A. Koning; Ashay A. Dani
Archive | 2005
Ashay A. Dani; Anna M. Prakash; Saikumar Jayaraman; Mitesh C. Patel; Vijay Wakharkar
Archive | 2006
Rahul N. Manepalli; Saikumar Jayaraman
Archive | 2006
Saikumar Jayaraman; Rahul N. Manepalli
Archive | 2006
Stephen E. Lehman; James C. Matayabas; Saikumar Jayaraman
Archive | 2006
Saikumar Jayaraman