Samuel Lakeou

Direct writing of electronic and sensor materials using a laser transfer technique

We present a laser-based direct write technique termed matrix-assisted pulsed-laserevaporation direct write (MAPLE DW). This technique utilizes a laser transparentfused silica disc coated on one side with a composite matrix consisting of the materialto be deposited mixed with a laser absorbing polymer. Absorption of laser radiationresults in the decomposition of the polymer, which aids in transferring the solute to anacceptor substrate placed parallel to the matrix surface. Using MAPLE DW, complexpatterns consisting of metal powders, ceramic powders, and polymer composites weretransferred onto the surfaces of various types of substrates with <10 micron resolutionat room temperature and at atmospheric pressure without the use of masks.Current trends for developing advanced electronic andsensor systems place great emphasis in achieving per-formance levels generally associated with integratedcircuits. This requires further miniaturization, while en-hancing the functionality and reliability of existing sys-tems. New strategies are needed in order to eliminate thelong lead times required for the fabrication of prototypesand evaluation of new materials and designs. The use ofrapid prototyping techniques such as direct write, whichdo not need photolithographic processing, provide a so-lution to the above requirements. Direct write technolo-gies do not compete with photolithography for size andscale but rather add a complementary tool for specificapplications requiring rapid turnaround and/or patterniteration, conformal patterning, or modeling difficult cir-cuits. Examples of direct write technologies for fabricat-ing or modifying metallic interconnects and/or otherelectronic passive elements include ink jet printing,

Laser direct-write of embedded electronic components and circuits

The development of embedded surface mount devices, ICs, interconnects and power source elements offers the ability to achieve levels of miniaturization beyond the capabilities of current manufacturing techniques. By burying or embedding the whole circuit under the surface, significant reduction in weight and volume can be achieved for a given circuit board design. In addition, embedded structures allow for improved electrical performance and enhanced function integration within traditional circuit board substrates. Laser-based direct-write (LDW) techniques offer an alternative for the fabrication of such embedded structures at a fraction of the cost and in less time that it would take to develop system-on-chip designs such as ASIC’s. Laser micromachining has been used in the past to machine vias and trenches on circuit board substrates with great precision, while laser forward transfer has been used to deposit patterns and multilayers of various electronic materials. At NRL, we have been exploring the use of these LDW techniques to both machine and deposit the various materials required to embed and connect individual components inside a given surface. This paper describes the materials and processes being developed for the fabrication of embedded microelectronic circuit structures using direct-write techniques alongside with an example of a totally embedded circuit demonstrated to date.

Direct writing of electronic materials using a new laser-assisted transfer/annealing technique

MAPLE direct write is anew laser-based direct write technique which combines the basic approach employed in laser induced forward transfer with the unique advantages of matrix assisted pulsed laser evaporation. The technique utilizes a laser transparent donor substrate with one side coated with a matrix consisting of the electronic material to be transferred mixed with an organic binder or vehicle. As with LIFT, the laser is focused through the transparent substrate onto the matrix coating. When a laser pulse strikes the coating, the matrix is transferred to an acceptor substrate placed parallel to the donor surface. Ex situ thermal or laser treatments can be used to decompose the matrix and anneal the transferred material, thus forming structures with the desired electronic properties. MAPLE DW is a maskless deposition process designed to operate in air and at room temperature that allows for the generation of complex patterns with micron scale linewidths. The various structures produced by MAPLE DW were characterized using 3D surface profilometry, scanning electron microscopy and optical microscopy. The electrical resistivity of the silver metal lines made by MAPLE DW was measured using an impedance analyzer. Patterns with Zn2SiO4:Mn powders were fabricated over the surface of a dragon fly wing without damaging it. An overview of the key elements of the MAPLE DW process including our current understanding of the material transfer mechanisms and its potential as a rapid prototyping technique will be discussed.

Laser Direct Writing of circuit elements and sensors

A novel approach for maskless deposition of numerous materials has been developed at the Naval Research Laboratory. This technique evolved from the combination of laser induced forward transfer and Matrix Assisted Pulsed Laser Evaporation (MAPLE), and utilizes a computer controlled laser micromachining system. The resulting process is called MAPLE-DW for MAPLE Direct Write. MAPLE-DW can be used for the rapid fabrication of circuits and their components without the use of masks. Using MAPLE-DW, a wide variety of materials have been transferred over different types of substrates such as glass, alumina, plastics, and various types of circuit boards. Materials such as metals, dielectrics, ferrites, polymers and composites have been successfully deposited without any loss in functionality. Using a computer controlled stage, the above mentioned materials were deposited at room temperature over various substrates independent of their stage, the above mentioned materials were deposited at room temperature over various substrates independent of their surface morphology, with sub-10micrometers resolution. In addition, multilayer structures comprising of different types of materials were demonstrated by this technique. These multilayer structures from the basis of prototype thin film electronics devices such as resistors, capacitors, cross-over lines, inductors, etc. An overview of the result obtained using MAPLE-DW as well as examples of several devices made using this technique is presented.

Matrix Assisted Pulsed Laser Evaporation Direct Write (MAPLE DW): A New Method to Rapidly Prototype Active and Passive Electronic Circuit Elements

We demonstrate a novel laser-based approach to perform rapid prototyping of active and passive circuit elements called MAPLE DW. This technique is similar in its implementation to laser induced forward transfer (LIFT), but different in terms of the fundamental transfer mechanism and materials used. In MAPLE DW, a focused pulsed laser beam interacts with a composite material on a laser transparent support transferring the composite material to the acceptor substrate. This process enables the formation of adherent and uniform coatings at room temperature and atmospheric pressure with minimal post-deposition modification required, i.e., ≤400°C thermal processing. The firing of the laser and the work piece (substrate) motion is computer automated and synchronized using software designs from an electromagnetic modeling program validating that this technique is fully CAD/CAM compatible. The final properties of the deposited materials depend on the deposition conditions and the materials used, but when optimized, the properties are competitive with other thick film techniques such as screen-printing. Specific electrical results for conductors are 3 /TiO 2 composite capacitors the k can be tuned between 4 and 100 and losses are

Matrix-assisted laser transfer of electronic materials for direct-write applications

A novel laser-based direct-write technique, called Matrix Assisted Pulsed Laser Evaporation Direct Write (MAPLE-DW), has been developed for the rapid prototyping of electronic devices. MAPLE-DW is a maskless deposition process operating under ambient conditions which allows for the rapid fabrication of complex patterns of electronic materials. The technique utilizes a laser transparent substrate with one side coated with a matrix of the materials of interest mixed with an organic vehicle. The laser is focused through the transparent substrate onto the matrix coating which aids in transferring the materials of interest to an acceptor substrate placed parallel to the matrix surface. With MAPLE-DW, diverse materials including metals, dielectrics, ferroelectrics, ferrites and polymers have been transferred onto various acceptor substrates. The capability for laser-modifying the surface of the acceptor substance and laser-post-processing the transferred material has been demonstrated as well. This simple yet powerful technique has been used to fabricate passive thin film electronic components such as resistors, capacitors and metal lines with good functional properties. An overview of these key results along with a discussion of their materials and properties characterization will be presented.

Display controller IC for Amharic numerals

The design of a controller circuit for an Amharic numerical display is described. The Amharic numerals, comprising numerals from 0 to 19, are displayed on two 5*7 dot or light-emitting-diode matrixes. The circuit controls the state (i.e. on or off) of each dot to display the desired Amharic numerals. The design is compiled in an integrated circuit chip form using a silicon compiler tool. Prototypes were manufactured and tested. The possible insertion of the design in a TV display control system is discussed. >

UDC-BDU Partnership: Renewable Energy Project at Bahir Dar University

The paper describes the realization of a standalone, PV/Wind powered water delivery system, undertaken jointly by the University of the District of Columbia in Washington, DC, USA and Bahir Dar University in Ethiopia. This UDC-BDU partnership was supported by a Seed Grant from the US Embassy in Ethiopia. The project is a model that can be duplicated in various rural communities which need ambulant water delivery. The proposed water delivery includes potable water to rural communities and cattle, as well as water for small scale drip-irrigation. The design introduces novel features providing versatility and mobility to the system. The paper describes also the academic merit of the project by highlighting its integration in the BDU’s undergraduate and graduate power engineering curricula.

Survey of Renewable Energy Installations in Rural Ethiopia and Design of a Low Cost Inverter for Rural Applications

Applications Samuel Lakeou, PhD (1, 2) Mengesha Mamo, PhD (3), Gudeta Gelalcha BSc (4) (1) Department of Electrical and Computer Engineering University of the District of Columbia, Washington, DC, USA (2) Director, Center of Excellence for Renewable Energy University of the District of Columbia, Washington, DC, USA (3) Associate Professor, Department of Electrical and Computer Engineering, Institute of Technology, Addis Ababa University, Addis Ababa, Ethiopia (4) Executive Director, Hope2020, Addis Ababa, Ethiopia