Sang Jeen Hong
Myongji University
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Publication
Featured researches published by Sang Jeen Hong.
Transactions on Electrical and Electronic Materials | 2009
Sung Joon Lee; Il Hwan Cho; Hyunwook Kim; Sang Jeen Hong; Hun Yong Lee
and process variables in the fabrication process of nanocrystalline dye sensitized solar cell. Systematic experiment to identify the effects of process variables on cell’s efficiency has based on broad-band absorption of light by tailor made organometallic dye molecules dispersed on a high surface of TiO
IEEE Transactions on Components, Packaging and Manufacturing Technology | 2014
Ja Myung Gu; Paragkumar A. Thadesar; Ashish Dembla; Muhannad S. Bakir; Gary S. May; Sang Jeen Hong
Through-silicon via (TSV) technology is a key enabler for 3-D and 2.5-D integration, which provides low-power and high-bandwidth chip-to-chip communication. During TSV fabrication, over-etching may cause notching at the base of the TSVs, resulting in TSV diameter variations. Endpoint detection (EPD) techniques are critical for controlling TSV diameter, and detecting the endpoint for low open areas presents a serious challenge to process engineers. In this paper, a hybrid partial least squares-support vector machine model for optical emission spectroscopy data are successfully demonstrated for an EPD of low open area TSVs. Accurate EPD results are shown for 120, 80, and 25 \(\mu\) m diameter TSVs.
Transactions on Electrical and Electronic Materials | 2013
Ho Jae Lee; Dongsun Seo; Sang Jeen Hong; Gary S. May
In-situ optical emission spectroscopy (OES) is employed for PECVD chamber monitoring. OES is used as an addon sensor to monitoring and cleaning end point detection (EPD). On monitoring plasma chemistry using OES, the process gas and by-product gas are simultaneously monitored. Principal component analysis (PCA) enhances the capability of end point detection using OES data. Through chamber cleaning monitoring using OES, cleaning time is reduced by 53%, in general. Therefore, the gas usage of fluorine is also reduced, so satisfying Green Fab challenge in semiconductor manufacturing.
advanced semiconductor manufacturing conference | 2013
Paragkumar A. Thadesar; Ja Myung Gu; Ashish Dembla; Sang Jeen Hong; Gary S. May; Muhannad S. Bakir
Silicon interposers with through-silicon vias (TSVs) have been widely explored to obtain high density and high bandwidth communication between chips. To reduce TSV electrical loss and stress, novel photodefined polymer-clad TSVs are fabricated. Moreover, to reduce via under or over etching during TSV fabrication and accurately predict the endpoint for TSV etching, a hybrid partial least squares-support vector machine (PLS-SVM) model of optical emission spectroscopy (OES) data is successfully demonstrated. Accurate endpoint detection results are shown for 80 μm diameter TSVs.
international interconnect technology conference | 2013
Ja Myung Gu; Paragkumar A. Thadesar; Ashish Dembla; Sang Jeen Hong; Muhannad S. Bakir; Gary S. May
A hybrid partial least squares-support vector machine (PLS-SVM) model of optical emission spectroscopy data is proposed and successfully demonstrated to predict the endpoint detection of through silicon vias (TSVs) etched using the Bosch process. Accurate results are shown for TSVs with diameters of 80 μm and 25 μm.
Microelectronic Engineering | 2015
Hanju Oh; Ja Myung Gu; Sang Jeen Hong; Gary S. May; Muhannad S. Bakir
Journal of the Korean Physical Society | 2006
Hoon Choi; Ji Chul Bae; Dae Wha Soh; Sang Jeen Hong
Microelectronic Engineering | 2009
Hoon Choi; Kyo-Ho Moon; Chulgu Lee; Il Hwan Cho; Sang Jeen Hong
international conference on microelectronics | 2009
Tae Yoon Kang; Gwangbeom Kim; Il Hwan Cho; Dongsun Seo; Sang Jeen Hong
Journal of information and communication convergence engineering | 2005
Sei-Young Mun; Gwang-Beom Kim; Dea-Wha Soh; Sang Jeen Hong