Satoshi Sendai | Researchain

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Archive | 1999

Substrate plating device

Akihisa Hongo; Naoaki Ogure; Hiroyuki Ueyama; Junitsu Yamakawa; Mizuki Nagai; Kenichi Suzuki; Atsushi Chono; Satoshi Sendai; Koji Mishima

Archive | 2000

Method and apparatus for plating substrate and plating facility

Satoshi Sendai; Akihisa Hongo; Kenya Tomioka; Katsumi Tsuda; Masayuki Kumekawa; Naoaki Ogure; Kenichi Sasabe

Archive | 2003

Plating apparatus and plating liquid removing method

Satoshi Sendai; Kenya Tomioka; Katsumi Tsuda

Archive | 1999

Wafer plating method and apparatus

Akihisa Hongo; Naoaki Ogure; Hiroaki Inoue; Satoshi Sendai; Tetsuma Ikegami; Koji Mishima; Shuichi Okuyama; Mizuki Nagai; Ryoichi Kimizuka; Megumi Maruyama

Archive | 1999

Wafer plating jig

Junichiro Yoshioka; Kenya Tomioka; Satoshi Sendai; Atsushi Chono; Naomitsu Ozawa

Archive | 1998

Plating apparatus for detecting the conductivity between plating contacts on a substrate

Junichiro Yoshioka; Satoshi Sendai; Atsushi Chono; Mitsuo Tada; Akihisa Hongo; Yoshitaka Mukaiyama; Kenya Tomioka; Akira Ogata; Kenichi Suzuki; Naomitsu Ozawa

Archive | 1997

Method for checking energization to wafer and plating jig and apparatus for checking energization

Atsushi Chono; Yoshitaka Mukoyama; Naomitsu Ozawa; Satoshi Sendai; Masaya Tomioka; Junichiro Yoshioka; 篤丁野; 敏千代; 潤一郎吉岡; 佳孝向山; 賢哉富岡; 直光小沢

Archive | 1998

Plating device and method of confirming current feed

Junichiro Yoshioka; Satoshi Sendai; Atsushi Chono; Mitsuo Tada; Akihisa Hongo; Yoshitaka Mukaiyama; Kenya Tomioka; Akira Ogata; Kenichi Suzuki; Naomitsu Ozawa

Archive | 1993