Satyam Choudary Cherukuri

Co-fired ceramic on metal multichip modules for advanced military packaging

A novel, low temperature co-fired ceramic on metal (LTCC-M) multilayer circuit board technology intended for dual-use by both the military and commercial market sectors is described in this paper. This technology has been optimized for low cost, high circuit density multichip modules and board level integration. Limitations of the present low-temperature co-fired ceramic systems have been overcome by using a metal core in the LTCC-M technology. This technology readily allows the design of rugged, yet lightweight, electronic modules. In addition, the co-fired metal core permits this technology to be readily scaleable in terms of circuit density, size, and power dissipation; thereby making this an excellent candidate for a dual-use technology. Several advanced military packaging applications are pointed out in this paper.<<ETX>>