Seungyoung Ahn

Design and Implementation of Shaped Magnetic-Resonance-Based Wireless Power Transfer System for Roadway-Powered Moving Electric Vehicles

In this paper, the design and implementation of a wireless power transfer system for moving electric vehicles along with an example of an online electric vehicle system are presented. Electric vehicles are charged on roadway by wireless power transfer technology. Electrical and practical designs of the inverter, power lines, pickup, rectifier, and regulator as well as an optimized core structure design for a large air gap are described. Also, electromotive force shielding for the electric vehicle is suggested. The overall system was implemented and tested. The experimental results showed that 100-kW power with 80% power transfer efficiency under 26-cm air gap was acquired.

Coil Design and Shielding Methods for a Magnetic Resonant Wireless Power Transfer System

In this paper, we introduce the basic principles of wireless power transfer using magnetic field resonance and describe techniques for the design of a resonant magnetic coil, the formation of a magnetic field distribution, and electromagnetic field (EMF) noise suppression methods. The experimental results of wireless power transfer systems in consumer electronics applications are discussed in terms of issues related to their efficiency and EMF noise. Furthermore, we present a passive shielding method and a magnetic field cancellation method using a reactive resonant current loop and the utilization of these methods in an online electric vehicle (OLEV) system, in which an OLEV green transportation bus system absorbs wireless power from power cables underneath the road surface with only a minimal battery capacity.

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

The impedance of a power-distribution network (PDN) in three-dimensionally stacked chips with multiple through-silicon-via (TSV) connections (a 3D TSV IC) was modeled and analyzed using a power/ground (P/G) TSV array model based on separated P/G TSV and chip-PDN models at frequencies up to 20 GHz. The proposed modeling and analysis methods for the P/G TSV and chip-PDN are fundamental for estimating the PDN impedances of 3D TSV ICs because they are composed of several chip-PDNs and several thousands of P/G TSV connections. Using the proposed P/G TSV array model, we obtained very efficient analyses and estimations of 3D TSV IC PDNs, including the effects of TSV inductance and multiple-TSV inductance, depending on P/G TSV arrangement and the number of stacked chip-PDNs of a 3D TSV IC PDN. Inductances related to TSVs, combined with chip-PDN inductance and capacitance, created high upper peaks of PDN impedance, near 1 GHz. Additionally, the P/G TSV array produced various TSV array inductance effects on stacked chip-PDN impedance, according to their arrangement, and induced high PDN impedance, over 10 GHz.

Low frequency electromagnetic field reduction techniques for the On-Line Electric Vehicle (OLEV)

In this paper, we introduce the On-line Electric Vehicle (OLEV) system and its non-contact power transfer mechanism and propose some techniques for the reduction of electromagnetic fields (EMFs) from the power line and the vehicle itself. By applying a metallic plate shield, horizontal/vertical shield, and connecting wire for loop cancellation, the low frequency EMFs have been significantly reduced. Simulation and measurement results for application to vehicles currently in service are also given.

Design and Analysis of a Resonant Reactive Shield for a Wireless Power Electric Vehicle

In this paper, we propose the concept and design methodology for a resonant reactive shield for the reduction of magnetic field leakage from a wireless power transfer (WPT) systems. By using LC resonance, the reactive shield can generate a cancelling magnetic field to reduce the incident magnetic field from WPT coils and effectively reduce the total magnetic field without consuming additional power. The shielding effectiveness of the resonant reactive shield and its effect on WPT efficiency are analyzed with simulation and measurements. For practical application to wirelessly charged electric vehicles, an automatic tuning system for the resonant reactive shield is also proposed and implemented. The effectiveness of a resonant reactive shielding is verified by experiments in a wirelessly charged electric bus.

Analytical expressions for maximum transferred power in wireless power transfer systems

In this paper, we present the analytical expressions of the resonant peaks of input impedance and the frequencies of maximum transferred power in the wireless power transfer systems in case of tight magnetic coupling. The analytical expressions predict the frequencies of power source where the maximum power is transferred in both cases of the constant AC voltage source and the constant AC current source. We prove that the resonant frequencies of the input impedance in the wireless power transfer systems coincide with the frequencies at which the transferred power is maximized for the constant AC voltage source and the constant AC current source. The test vehicles of the coupled rectangular coils are simulated with 3D EM solver and fabricated on printed circuit boards. Experimentally, it is verified that the analytical expressions predict the changes in the resonant peaks of input impedance of the wireless power transfer systems, its relationship with frequencies of maximum transferred power and their dependency with the source type in the wireless power transfer systems.

Charging up the road

PICTURE AN ALL-ELECTRIC VEHICLE cruising down the highway, emitting little noise and no noxious fumes. Its such an improvement that you have to wonder why only a handful of all-electric vehicles are now available on the mass market. · Heres a big reason: Picture the driver of that same car getting a call from a relative living far away who needs immediate help. Suddenly, the drivers eyes become riveted on the most important indicator on the dashboard: the estimated number of kilometers that the car can go on the remaining battery charge. Will he make it to his relatives house? Even if he does, will he find a charging station so he can get back home?

Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

Microwave model and high-frequency measurement of the anisotropically conductive film (ACF) flip-chip interconnection was investigated using a microwave network analysis. The test integrated circuits (ICs) were fabricated using a 1-poly and 3-metal 0.6 /spl mu/m Si process with an inverted embedded microstrip structure. As flip chip bumps, electroless Ni/Au plating was performed on Al input/output (I/O) pads of test IC chips, As an interconnect material, several ACFs were prepared and flip-chip bonded onto the Rogers(R) RO4003 high frequency organic substrate. S-parameters of on-chip and substrate were separately measured in the frequency range of 200 MHz to 20 GHz using a microwave network analyzer HP8510 and cascade probe, and the cascade transmission matrix conversion was performed. The same measurements and conversion were conducted on the test chip mounted substrates at the same frequency range. Then impedance values in flip-chip interconnection were extracted from cascade transmission matrix. The extracted model parameters of the 100 /spl mu/m/spl times/100 /spl mu/m interconnect pad show the resistance increases due to skin effect up to 8 GHz. Above this frequency, conductive loss of epoxy resin also increases. Reactance is dominantly affected by inductance of Ni/Au bumps and also conductive particles in the ACF interconnection over the measured frequency range. The inductance value of ACF flip chip interconnection is below 0.05 nH and the contact resistance is below 0.9 R. In addition, the effects of different ACF conductive particle materials on high frequency electrical behavior in GHz range were also investigated, Different ACF conductive particle materials show difference in the reactance, resistance, and resonance frequency behavior up to 13 GHz. Our results indicate that high frequency electrical performance of ACF combined with electroless Ni/Au bump interconnection is acceptable for use in the high frequency flip chip application up to 13 GHz. Finally, 80-ps rise time digital signal transmission with small dispersion low loss reflection was demonstrated through the flip-chip interconnection with combination of ACF and Ni/Au bump.

Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage

For wireless charging of electric vehicle (EV) batteries, high-frequency magnetic fields are generated from magnetically coupled coils. The large air-gap between two coils may cause high leakage of magnetic fields and it may also lower the power transfer efficiency (PTE). For the first time, in this paper, we propose a new set of coil design formulas for high-efficiency and low harmonic currents and a new design procedure for low leakage of magnetic fields for high-power wireless power transfer (WPT) system. Based on the proposed design procedure, a pair of magnetically coupled coils with magnetic field shielding for a 1-kW-class golf-cart WPT system is optimized via finite-element simulation and the proposed design formulas. We built a 1-kW-class wireless EV charging system for practical measurements of the PTE, the magnetic field strength around the golf cart, and voltage/current spectrums. The fabricated system has achieved a PTE of 96% at the operating frequency of 20.15 kHz with a 156-mm air gap between the coils. At the same time, the highest magnetic field strength measured around the golf cart is 19.8 mG, which is far below the relevant electromagnetic field safety guidelines (ICNIRP 1998/2010). In addition, the third harmonic component of the measured magnetic field is 39 dB lower than the fundamental component. These practical measurement results prove the effectiveness of the proposed coil design formulas and procedure of a WPT system for high-efficiency and low magnetic field leakage.

Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs

It is widely-known that coupling exists between adjacent through-silicon vias (TSVs) in 3D ICs. Since this TSV-to-TSV coupling is not negligible, it is highly likely that TSV-to-TSV coupling affects crosstalk significantly. Although a few works have already analyzed coupling in 3D ICs, they used S-parameter-based methods under the assumption that all ports in their simulation structures are under 50-Ω termination condition. However, this 50-Ω termination condition does not occur at ports (pins) of gates inside a 3D IC. In this paper, therefore, we analyze TSV-to-TSV coupling in 3D ICs based on a lumped circuit model with a realistic high-impedance termination condition. We also analyze how channel affect TSV-to-TSV coupling differently in different frequency ranges. Based on our results, we propose a technique to reduce TSV-to-TSV coupling in 3D ICs.