Shantonu Biswas
Technische Universität Ilmenau
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Publication
Featured researches published by Shantonu Biswas.
Advanced Materials | 2014
Se-Chul Park; Jun Fang; Shantonu Biswas; Mahsa Mozafari; Thomas Stauden; Heiko O. Jacobs
A first automated reel-to-reel fluidic selfassembly process for macroelectronic applications is reported. This system enables high-speed assembly of semiconductor dies (15 000 chips per hour using a 2.5 cm-wide web) over large-area substrates. The optimization of the system (>99% assembly yield) is based on identification, calculation, and optimization of the relevant forces. As an application, the production of a solid-state lighting panel is discussed, involving a novel approach to apply a conductive layer through lamination.
Micromachines | 2016
Shantonu Biswas; Mahsa Mozafari; Thomas Stauden; Heiko O. Jacobs
This publication provides an overview and discusses some challenges of surface tension directed fluidic self-assembly of semiconductor chips which are transported in a liquid medium. The discussion is limited to surface tension directed self-assembly where the capture, alignment, and electrical connection process is driven by the surface free energy of molten solder bumps where the authors have made a contribution. The general context is to develop a massively parallel and scalable assembly process to overcome some of the limitations of current robotic pick and place and serial wire bonding concepts. The following parts will be discussed: (2) Single-step assembly of LED arrays containing a repetition of a single component type; (3) Multi-step assembly of more than one component type adding a sequence and geometrical shape confinement to the basic concept to build more complex structures; demonstrators contain (3.1) self-packaging surface mount devices, and (3.2) multi-chip assemblies with unique angular orientation. Subsequently, measures are discussed (4) to enable the assembly of microscopic chips (10 μm–1 mm); a different transport method is introduced; demonstrators include the assembly of photovoltaic modules containing microscopic silicon tiles. Finally, (5) the extension to enable large area assembly is presented; a first reel-to-reel assembly machine is realized; the machine is applied to the field of solid state lighting and the emerging field of stretchable electronics which requires the assembly and electrical connection of semiconductor devices over exceedingly large area substrates.
Advanced Materials | 2015
Se-Chul Park; Shantonu Biswas; Jun Fang; Mahsa Mozafari; Thomas Stauden; Heiko O. Jacobs
A millimeter thin rubber-like solid-state lighting module is reported. The fabrication of the lighting module incorporates assembly and electrical connection of light-emitting diodes (LEDs). The assembly is achieved using a roll-to-roll fluidic self-assembly. The LEDs are sandwiched in-between a stretchable top and bottom electrode to relieve the mechanical stress. The top contact is realized using a lamination technique that eliminates wire-bonding.
IEEE\/ASME Journal of Microelectromechanical Systems | 2015
Se-Chul Park; Jun Fang; Shantonu Biswas; Mahsa Mozafari; Thomas Stauden; Heiko O. Jacobs
This paper presents the implementation of an automated roll-to-roll fluidic self-assembly system based on the surface tension driven self-assembly with applications in the field of macroelectronics. The reported system incorporates automated agitation, web motion, component dispensing, and recycling. The process enables the assembly and electrical connection of semiconductor dies/chips in a continuous and parallel fashion over wide area substrates. At present, the method achieves an assembly rate of 15000 chips per hour and an assembly yield exceeding 99%, testing assembly of standard square-shaped dies, 300-1000 μm size. Scaling the system to any desired throughput is possible due to the parallel manner of selfassembly. The identification and the modeling of the relationship between process parameters and forces have been studied and experimentally verified by testing the effect of the web angle, agitation on assembly, and detachment rates. As an application, we demonstrate the realization of a solid-state lighting module. This particular application requires the assembly of a conductive multilayer sandwich structure, which is achieved by combining the introduced assembly process with a novel lamination step.
Applied Physics Letters | 2017
Shantonu Biswas; Johannes Reiprich; Thaden Cohrs; Thomas Stauden; J. Pezoldt; Heiko O. Jacobs
This article describes the realization of a metamorphic stretchable microphone array, which can be inflated by air to morph from a planar to a hemispherical shape. The array undergoes morphological changes to adjust their receive characteristic. To realize this device, a metamorphic printed circuit board technology (m-PCB) is described. The resulting products are millimeter-thin stretchable silicone embedded and electrically interconnected electronic structures with mechanical properties, which resemble a silicone membrane. The microphone array is used to localize a sound source in a 3D space. The results of the planar orientation (resting shape), and the 3D hemispherical orientation after air inflation are compared. The inflated hemispherical microphone array proofs to be better for 3D acoustic localization and/or beam-forming.
Npg Asia Materials | 2016
Shantonu Biswas; Andreas Schöberl; Mahsa Mozafari; Jörg Pezoldt; Thomas Stauden; Heiko O. Jacobs
Sensors and Actuators B-chemical | 2018
Johannes Reiprich; Michael Gebinoga; Lutz-Philipp Traue; Leslie Schlag; Shantonu Biswas; Mahsa Kaltwasser; Maria Christine Honecker; Thomas Stauden; Jörg Pezoldt; Andreas Schober; Heiko O. Jacobs
Flexible and Printed Electronics | 2018
Shantonu Biswas; Johannes Reiprich; J. Pezoldt; Matthias Hein; Thomas Stauden; Heiko O. Jacobs
Science Trends | 2017
Shantonu Biswas; Heiko O. Jacobs
Advanced materials and technologies | 2017
Shantonu Biswas; Johannes Reiprich; Thaden Cohrs; David T. Arboleda; Andreas Schoeberl; Mahsa Mozafari; Leslie Schlag; Thomas Stauden; J. Pezoldt; Heiko O. Jacobs