Shinji Hatae

A new high capacity compact power modules for high power EV/HEV inverters

This paper presents a new power semiconductor IGBT module family dedicated for Electric Vehicle (EV) and Hybrid Electric Vehicle (HEV) power-train inverter applications, especially for higher power requirements. The new IGBT module family adopts a 6-in-1 circuit configuration with an optimized internal layout, Direct Lead Bond (DLB) structure and an integrated Al fin for direct liquid cooling. As a result, this new power module family has simultaneously achieved high performance, low self-inductance, small size and light weight. Compared to conventional products with similar power capabilities, the adoption of these innovative technologies has led to a 20% improvement in thermal performance, 30% reduction of self-inductance, 50% reduction of the modules footprint, and a 70% reduction of the modules weight.