Shintaro Komatani

Helium ion microscope characterization for Cu / low-k interconnects - SE imaging and focused helium ion beam luminescence detection -

Several novel imaging modes of the recently developed helium ion microscope (HIM) 1) were explored that may make the HIM a tool of particular value to Cu / low-k (dielectric constant) interconnect structures. Mechanism of the “through dielectric” (2) imaging of the Cu interconnects underneath the low-k SiOC film was proposed, and materials contrast in the low-k regions between Cu lines was imaged which might reflect damaged low-k areas. Furthermore possibility of detection of luminescence induced by the focused helium ion beam using the HIM for materials property characterizations was studied for the first time.

Three-Dimensional Microscopic Elemental Analysis Using an Automated High-Precision Serial Sectioning System

The elemental composition and microscopic-level shape of inclusions inside industrial materials are considered important factors in fracture analytical studies. In this work, a three-dimensional (3D) microscopic elemental analysis system based on a serial sectioning technique was developed to observe the internal structure of such materials. This 3D elemental mapping system included an X-ray fluorescence analyzer and a high-precision milling machine. Control signals for the X-ray observation process were automatically sent from a data I/O system synchronized with the precision positioning on the milling machine. Composite specimens were used to confirm the resolution and the accuracy of 3D models generated from this system. Each of the two specimens was composed of three metal wires of 0.5 mm diameter braided into a single twisted wire that was placed inside a metal pipe; the pipe was then filled with either epoxy resin or Sn. The milling machine was used to create a mirror-finish cross-sectional surface on these specimens, and elemental analyses were performed. The twisted wire structure was clearly observed in the resulting 3D models. This system enables automated investigation of the 3D internal structure of materials as well as the identification of their elemental components.

Minute foreign materials analysis using mono-capillary with 10-micrometer spatial resolution

The scanning X-ray microscope is an analysis device that irradiates a fine X-ray beam on the sample, measures fluorescent X-rays and transmitted X-rays that occur from the sample while scanning, and obtains fluorescent and transmitted X-ray images. It includes the following features atmospheric analysis (no vacuum required), no requirement for sample pre-treatment and non-destructive analysis (all in contrast with SEM-EDX that must be performed in a vacuum, and often requires a conductive coating). In addition, because of the transmission of X-rays through the sample, analysis can be made inside without exposing the area of interest. The spatial resolution of the scanning Xray microscope depends on the diameter of the X-ray beam. We use a scanning X-ray microscope with mono-capillary X-ray guide tube which has the narrowest X-Ray beam available. The diameter of this X-ray beam is 10 micrometers.