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Simon S. Chan

Advanced Micro Devices

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Archive | 1998

Method for forming conformal barrier layers

Young-Chang Joo; Dirk Brown; Simon S. Chan

Archive | 1996

TUNNELING TECHNOLOGY FOR REDUCING INTRA-CONDUCTIVE LAYER CAPACITANCE

Robin W. Cheung; Simon S. Chan; Richard J. Huang

Archive | 1999

Surface treatment of low-K SiOF to prevent metal interaction

Richard J. Huang; Guarionex Morales; Simon S. Chan

Archive | 1998

Method for forming a dual damascene trench and underlying borderless via in low dielectric constant materials

Simon S. Chan; Fei Wang; Todd P. Lukanc

Archive | 1997

Method for reducing electromigration in a copper interconnect

Takeshi Nogami; Simon S. Chan

Archive | 1999

Dummy patterning for semiconductor manufacturing processes

Lu You; Simon S. Chan; Kai Yang

Archive | 2001

Dual damascene arrangement for metal interconnection with low k dielectric constant materials in dielectric layers

Fei Wang; Jerry Cheng; Simon S. Chan; Todd P. Lukanc

Archive | 1998

Method of forming a dual damascene trench and borderless via structure

Simon S. Chan; Fei Wang; Todd P. Lukanc

Archive | 2002

Silicide MOSFET architecture and method of manufacture

Mario M. Pelella; Shankar Sinha; Simon S. Chan

Archive | 1995

Low rc interconnection

Lu You; Robin W. Cheung; Simon S. Chan; Richard J. Huang

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