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Sri Ranga Sai Boyapati

Intel

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Publication

Featured researches published by Sri Ranga Sai Boyapati.

Archive | 2016

INTEGRATION OF EMBEDDED THIN FILM CAPACITORS IN PACKAGE SUBSTRATES

Robert L. Sankman; Daniel N. Sobieski; Sri Ranga Sai Boyapati

Archive | 2014

Laser cavity formation for embedded dies or components in substrate build-up layers

Chong Zhang; Stefanie M. Lotz; Qinglei Zhang; Sri Ranga Sai Boyapati; Nikhil Sharma; Islam A. Salama

Archive | 2013

METHODS OF FORMING SUBSTRATE MICROVIAS WITH ANCHOR STRUCTURES

Sri Ranga Sai Boyapati; Qinglei Zhang

Archive | 2018

PACKAGE WITH PASSIVATED INTERCONNECTS

Sri Ranga Sai Boyapati; Rahul N. Manepalli; Dilan Seneviratne; Srinivas V. Pietambaram; Kristof Darmawikarta; Robert Alan May; Islam A. Salama

Archive | 2017

ELECTRONIC PACKAGE AND METHOD FORMING AN ELECTRICAL PACKAGE

Kristof Darmawikarta; Daniel N. Sobieski; Kyu Oh Lee; Sri Ranga Sai Boyapati

Archive | 2017

NONDESTRUCTIVE OPTICAL DETECTION OF TRACE UNDERCUT, WIDTH AND THICKNESS

Robert Alan May; Sri Ranga Sai Boyapati; Zhiyong Wang; Shuhong Liu; Pilin Liu

Archive | 2017

Inorganic interposer for multi-chip packaging

Daniel N. Sobieski; Kristof Darmawikarta; Sri Ranga Sai Boyapati; Merve Celikkol; Kyu Oh Lee; Kemal Aygun; Zhiguo Qian

Archive | 2017

DESMEAR WITH METALIZED PROTECTIVE FILM

Zheng Zhou; Amanda E. Schuckman; Sri Ranga Sai Boyapati

Archive | 2017

PLASMA ETCHING OF SOLDER RESIST OPENINGS

Kristof Darmawikarta; Rahul Jain; Robert Alan May; Sheng Li; Sri Ranga Sai Boyapati

Archive | 2015

Integration eingebetteter Dünnfilmkondensatoren in Gehäusesubstraten Integration of embedded thin film capacitors in package substrates

Robert L. Sankman; Daniel N. Sobieski; Sri Ranga Sai Boyapati

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Collaboration

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Daniel N. Sobieski

Intel

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Robert Alan May

Intel

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Islam A. Salama

Intel

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Qinglei Zhang

Intel

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Amanda E. Schuckman

Intel

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Amruthavalli P. Alur

Intel

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Chong Zhang

University of Central Florida

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Dilan Seneviratne

Intel

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Kemal Aygun

Intel

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Rahul Jain

Intel

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