Sribalan Santhanam
Broadcom
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Publication
Featured researches published by Sribalan Santhanam.
international solid-state circuits conference | 1998
Sribalan Santhanam; Allen J. Baum; David Bertucci; Mike Braganza; Kevin Broch; Todd Broch; Jim Burnette; Edward Chang; Kwong-Tak Chui; Dan Dobberpuhl; Paul M. Donahue; Joel Grodstein; Insung Kim; Daniel Murray; Mark H. Pearce; Amy K. Silveria; Dave Souydalay; Aaron T. Spink; Robert Stepanian; Anand Varadharajan; Vincent R. von Kaenel; Ricky Wen
This custom CPU derived from the StrongARM/sup TM/ 110 is capable of more than 2 billion 16 b operations per second (2 BOPs). Starting with the original design, an attached media processor (AMP) is integrated along with a synchronous DRAM memory controller and separate I/O bus. In addition, several enhancements are made to the CPU and cache subsystem and the chip is reduced from 0.35 /spl mu/m to 0.28 /spl mu/m technology. The chip includes 3.3M transistors and measures 60 mm/sup 2/. It dissipates less than 3 W at 300 MHz at 2.0 V internal, 3.3 V I/O. The chip supports dynamic clock frequency switching for reduced operating power during low performance demands. There are 333 separately conditioned clocks on the chip. For battery powered applications, Vdd is reduced to achieve <0.5 W operation at 150 MHz. The chip is pseudo-static and supports clock stop and IDDQ testing.
symposium on vlsi circuits | 2001
Sribalan Santhanam; R. Allmon; K. Anne; R. Blake; N. Bunger; Brian J. Campbell; M. Carlson; Zongjian Chen; J. Cheng; Tuan Do; Daniel W. Dobberpuhl; Joseph M. Ingino; D. Kidd; David A. Kruckemyer; Jong Lee; Daniel C. Murray; S. Nishimoto; L. O'Donnell; M. Oykher; M. Panich; Mark H. Pearce; D. Priore; D. Rodriguez; Robert Rogenmoser; Dongwook Suh; V. Sundaresan; E. Supnet; V. von Kaenel; G. Yee; G. Yiu
The Broadcom BCM12500 is a high performance system on a chip (SOC) targeted at network centric tasks. The chip consists of two high performance SB-1 MIPS64/sup TM/ CPUs, a shared 512 KB L2 cache, a DDR memory controller, and integrated I/O. All major blocks of the processor are connected together via the ZBbus/sup TM/; a high speed split transaction fully coherent multi processor bus. Three Gigabit Ethernet MACs enable a direct interface to network elements. High-speed system I/O is provided using AMDs Lightning Data Transport (LDT/sup TM/) I/O fabric and a 66 MHz PCI bus. The die measures 14.2 mm by 13.3 mm in a bulk 0.15 /spl mu/m CMOS technology and has a power dissipation of 13 W at 1.2 V and 1 GHz.
Archive | 2002
Sribalan Santhanam; Vincent R. von Kaenel; David A. Kruckemyer
Archive | 2003
Sribalan Santhanam; Vincent R. von Kaenel; David A. Kruckemyer
Digital Technical Journal | 1997
James Montanaro; Richard T. Witek; Krishna Anne; Andrew J. Black; Elizabeth M. Cooper; Daniel W. Dobberpuhl; Paul M. Donahue; Jim Eno; Gregory W. Hoeppner; David A. Kruckemyer; Thomas H. Lee; Peter C. M. Lin; Liam Madden; Daniel C. Murray; Mark H. Pearce; Sribalan Santhanam; Kathryn J. Snyder; Ray Stephany; Stephen C. Thierauf
Archive | 2007
Zongjian Chen; Priya Ananthanarayanan; Sukalpa Biswas; Brian H. Campbell; Hao Chen; Shailendra S. Desai; Shaishav Desai; Dominic Go; Rajat Goel; Vincent R. von Kaenel; Jason Kassoff; Fabian Klass; Weichun Ku; Tony Li; Jonathon Lin; Khurram Z. Malik; Anup S. Mehta; Dan Murray; Eric Shiu; Sribalan Santhanam; Greg Scott; Junji Sugisawa; Honkai Tam; Pradeep Trivedi; James Wang; Ricky Wen; John Yong
Archive | 2006
Brian J. Campbell; Kaenel Vincent R. Von; Gregory S. Scott; Sribalan Santhanam; Daniel Murray
Archive | 2006
Brian J. Campbell; Kaenel Vincent R. Von; Gregory S. Scott; Sribalan Santhanam; Daniel Murray
Archive | 2006
Brian J. Campbell; Kaenel Vincent R. Von; Gregory S. Scott; Sribalan Santhanam; Daniel Murray
Archive | 2006
Brian J. Campbell; Daniel Murray; Sribalan Santhanam; Gregory S. Scott; Kaenel Vincent R. Von