Srinivasan Murali

NoC synthesis flow for customized domain specific multiprocessor systems-on-chip

The growing complexity of customizable single-chip multiprocessors is requiring communication resources that can only be provided by a highly-scalable communication infrastructure. This trend is exemplified by the growing number of network-on-chip (NoC) architectures that have been proposed recently for system-on-chip (SoC) integration. Developing NoC-based systems tailored to a particular application domain is crucial for achieving high-performance, energy-efficient customized solutions. The effectiveness of this approach largely depends on the availability of an ad hoc design methodology that, starting from a high-level application specification, derives an optimized NoC configuration with respect to different design objectives and instantiates the selected application specific on-chip micronetwork. Automatic execution of these design steps is highly desirable to increase SoC design productivity. This work illustrates a complete synthesis flow, called Netchip, for customized NoC architectures, that partitions the development work into major steps (topology mapping, selection, and generation) and provides proper tools for their automatic execution (SUNMAP, xpipescompiler). The entire flow leverages the flexibility of a fully reusable and scalable network components library called xpipes, consisting of highly-parameterizable network building blocks (network interface, switches, switch-to-switch links) that are design-time tunable and composable to achieve arbitrary topologies and customized domain-specific NoC architectures. Several experimental case studies are presented In the work, showing the powerful design space exploration capabilities of the proposed methodology and tools.

Temperature-aware processor frequency assignment for MPSoCs using convex optimization

The increasing processing capability of Multi-Processor Systems-on-Chips (MPSoCs) is leading to an increase in chip power dissipation, which in turn leads to significant increase in chip temperature. An important challenge facing the MPSoC designers is to achieve the highest performance system operation that satisfies the temperature and power consumption constraints. The frequency of operation of the different processors and the application workload assignment play a critical role in determining the performance, power consumption and temperature profile of the MPSoC. In this paper, we propose novel convex optimization based methods that solve this important problem of temperature-aware processor frequency assignment, such that the total system performance is maximized and the temperature and power constraints are met. We perform experiments on several realistic SoC benchmarks using a cycle-accurate FPGA-based thermal emulation platform, which show that the systems designed using our methods meet the temperature and power consumption requirements at all time instances, while achieving maximum performance.

Invited paper: Network-on-Chip design and synthesis outlook

With the growing complexity in consumer embedded products, new tendencies forecast heterogeneous Multi-Processor Systems-On-Chip (MPSoCs) consisting of complex integrated components communicating with each other at very high-speed rates. Intercommunication requirements of MPSoCs made of hundreds of cores will not be feasible using a single shared bus or a hierarchy of buses due to their poor scalability with system size, their shared bandwidth between all the attached cores and the energy efficiency requirements of final products. To overcome these problems of scalability and complexity, Networks-On-Chip (NoCs) have been proposed as a promising replacement to eliminate many of the overheads of buses and MPSoCs connected by means of general-purpose communication architectures. However, the development of application-specific NoCs for MPSoCs is a complex engineering process that involves the definition of suitable protocols and topologies of switches, and which demands adequate design flows to minimize design time and effort. In fact, the development of suitable high-level design and synthesis tools for NoC-based interconnects is a key element to benefit from NoC-based interconnect design in nanometer-scale CMOS technologies. In this article we overview the benefits of state-of-the-art NoCs using a complete NoC synthesis flow, and a detailed scalability analysis of different NoC implementations for the latest nanometer-scale technology nodes. We present NoC-based solutions for the on-chip interconnects of MPSoCs that illustrate the benefits of competitive application-specific NoCs with respect to more regular NoC topologies regarding performance, area and power. Moreover, we show that it is currently feasible to synthesize in an automatic way a complete custom NoC interconnect from a high-level specification in few hours. Finally, we summarize future research challenges in the area of NoC interconnect design automation.

SunFloor 3D: a tool for networks on chip topology synthesis for 3D systems on chips

Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on Chip (NoC) interconnect for a 3D SoC that not only meets the application performance constraints, but also the constraints imposed by the 3D technology, is a significant challenge. In this work we present a design tool, SunFloor 3D, to synthesize application-specific 3D NoCs. The proposed tool determines the best NoC topology for the application, finds paths for the communication flows, assigns the network components on to the 3D layers and performs a placement of them in each layer. We perform experiments on several SoC benchmarks and present a comparative study between 3D and 2D NoC designs. Our studies show large improvements in interconnect power consumption (average of 38%) and delay (average of 13%) for the 3D NoC when compared to the corresponding 2D implementation. Our studies also show that the synthesized topologies result in large power (average of 54%) and delay savings (average of 21%) when compared to standard topologies.

Temperature control of high-performance multi-core platforms using convex optimization

With technology advances, the number of cores integrated on a chip and their speed of operation is increasing. This, in turn is leading to a significant increase in chip temperature. Temperature gradients and hot-spots not only affect the performance of the system, but also lead to unreliable circuit operation and affect the life-time of the chip. Meeting the temperature constraints and reducing the hot-spots are critical for achieving reliable and efficient operation of complex multi-core systems. In this work, we present Pro-Temp, a convex optimization based method that pro-actively controls the temperature of the cores, while minimizing the power consumption and satisfying application performance constraints. The method guarantees that the temperature of the cores are below a user- defined threshold at all instances of operation, while also reducing the hot-spots. We perform experiments on several realistic multi-core benchmarks, which show that the proposed method guarantees that the cores never exceed the maximum temperature limit, while matching the application performance requirements. We compare this to traditional methods, where we find several temperature violations during the operation of the system.

Synthesis of networks on chips for 3D systems on chips

Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (NoCs) are necessary to efficiently handle the 3D interconnect complexity. Designing power efficient NoCs for 3D SoCs that satisfy the application performance requirements, while satisfying the 3D technology constraints is a big challenge. In this work, we address this problem and present a synthesis approach for designing power-performance efficient 3D NoCs. We present methods to determine the best topology, compute paths and perform placement of the NoC components in each 3D layer. We perform experiments on varied, realistic SoC benchmarks to validate the methods and also perform a comparative study of the resulting 3D NoC designs with 3D optimized mesh topologies. The NoCs designed by our synthesis method results in large interconnect power reduction (average of 38%) and latency reduction (average of 25%) when compared to traditional NoC designs.

Bringing NoCs to 65nm

Very deep submicron process technologies are ideal application fields for NoCs, which offer a promising solution to the scalability problem. This article sheds light on the benefits and challenges of Noc-Based interconnect design in nanometer CMOS. The author present experimental results from fully working 65-NM Noc Designs and a detailed scalability analysis.

Bringing NoCs to 65 nm

Very deep submicron process technologies are ideal application fields for NoCs, which offer a promising solution to the scalability problem. This article sheds light on the benefits and challenges of NoC-based interconnect design in nanometer CMOS. The experimental results from fully working 65-nm NoC designs and a detailed scalability analysis are presented. The network on chip (NoC) is a promising solution to the scalability problem. NoCs build upon improvements in bus architecture-for example, in terms of topology design.

A Method for Routing Packets Across Multiple Paths in NoCs with In-Order Delivery and Fault-Tolerance Gaurantees

Networks on Chips (NoCs) are required to tackle the increasing delay and poor scalability issues of bus-based communication architectures. Many of todays NoC designs are based on single path routing. By utilizing multiple paths for routing, congestion in the network is reduced significantly, which translates to improved network performance or reduced network bandwidth requirements and power consumption. Multiple paths can also be utilized to achieve spatial redundancy, which helps in achieving tolerance against faults or errors in the NoC. A major problem with multipath routing is that packets can reach the destination in an out-of-order fashion, while many applications require in-order packet delivery. In this work, we present a multipath routing strategy that guarantees in-order packet delivery for NoCs. It is based on the idea of routing packets on partially nonintersecting paths and rebuilding packet order at path reconvergent nodes. We present a design methodology that uses the routing strategy to optimally spread the traffic in the NoC to minimize the network bandwidth needs and power consumption. We also integrate support for tolerance against transient and permanent failures in the NoC links in the methodology by utilizing spatial and temporal redundancy for transporting packets. Our experimental studies show large reduction in network bandwidth requirements (36.86% on average) and power consumption (30.51% on average) compared to single-path systems. The area overhead of the proposed scheme is small (a modest 5% increase in network area). Hence, it is practical to be used in the on-chip domain.

SunFloor 3D: A Tool for Networks on Chip Topology Synthesis for 3-D Systems on Chips

Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on Chip (NoC) interconnect for a 3D SoC that not only meets the application performance constraints, but also the constraints imposed by the 3D technology, is a significant challenge. In this work we present a design tool, SunFloor 3D, to synthesize application-specific 3D NoCs. The proposed tool determines the best NoC topology for the application, finds paths for the communication flows, assigns the network components on to the 3D layers and performs a placement of them in each layer. We perform experiments on several SoC benchmarks and present a comparative study between 3D and 2D NoC designs. Our studies show large improvements in interconnect power consumption (average of 38%) and delay (average of 13%) for the 3D NoC when compared to the corresponding 2D implementation. Our studies also show that the synthesized topologies result in large power (average of 54%) and delay savings (average of 21%) when compared to standard topologies.