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Stefan Wein

Rolf C. Hagen Group

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Publication

Featured researches published by Stefan Wein.

Archive | 2002

Electronic component with a plastic housing and method for production thereof

Bernd Goller; Robert Christian Hagen; Gerald Ofner; Christian Stuempfl; Josef Thumbs; Stefan Wein; Holger Woerner

Archive | 2002

Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component

Bernd Goller; Gerald Ofner; Josef Thumbs; Holger Wörner; Robert-Christian Hagen; Christian Stümpfl; Stefan Wein

Archive | 2003

Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device

Bernd Goller; Robert-Christian Hagen; Christian Stuempfl; Stefan Wein; Holger Woerner

Archive | 2003

Universal package for an electronic component with a semiconductor chip and method for producing the universal package

Bernd Goller; Robert-Christian Hagen; Gerald Ofner; Christian Stuempfl; Stefan Wein; Holger Wörner

Archive | 2002

Electronic component and process for producing the electronic component

Bernd Goller; Robert-Christian Hagen; Gerald Ofner; Christian Stümpfl; Josef Thumbs; Stefan Wein; Holger Wörner

Archive | 2002

Electronic component with at least two stacked semiconductor chips, and fabrication method

Bernd Goller; Gerald Ofner; Josef Thumbs; Holger Wörner; Robert-Christian Hagen; Christian Stümpfl; Stefan Wein

Archive | 2001

Verfahren zur Herstellung eines elektronischen Bauteils mit einem Kuststoffgehäuse und elektronisches Bauteil

Bernd Goller; Robert Hagen; Gerald Ofner; Christian Stümpfl; Josef Thumbs; Stefan Wein; Holger Wörner

Archive | 2002

Elektronisches Bauteil als Multichipmodul und Verfahren zu dessen Herstellung

Bernd Goller; Robert-Christian Hagen; Christian Stümpfl; Stefan Wein; Holger Wörner

Archive | 2003

Universal semiconductor housing with precrosslinked plastic embedding compounds, and method of producing the semiconductor housing

Bernd Goller; Robert-Christian Hagen; Gerald Ofner; Christian Stuempfl; Stefan Wein; Holger Wörner

Archive | 2003

Universal housing for an electronic semiconductor device and method of its manufacture

Bernd Goller; Robert-Christian Hagen; Gerald Ofner; Christian Stümpfl; Stefan Wein; Holger Wörner

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Collaboration

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Gerald Ofner

Infineon Technologies

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Josef Thumbs

Infineon Technologies

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Christian Stuempfl

Infineon Technologies

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Holger Woerner

Infineon Technologies

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Robert Hagen

Infineon Technologies

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