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Dive into the research topics where Steven J. Sherman is active.

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Featured researches published by Steven J. Sherman.


IEEE Journal of Solid-state Circuits | 2002

Single-chip surface micromachined integrated gyroscope with 50/spl deg//h Allan deviation

John A. Geen; Steven J. Sherman; J.F. Chang; S.R. Lewis

The design principles of a mass-produced surface micromachined gyroscope are described. The device is integrated on a single 3 mm/spl times/3 mm chip with a 3-/spl mu/m BiCMOS process. It has a 4-/spl mu/m-thick polysilicon structure, 5-V 6-mA supply, 12.5-mV//spl deg//S sensitivity, 10 000:1 dynamic range, 30 000-gee shock survival, and -55/spl deg/C to +85/spl deg/C operating temperature.


symposium on vlsi circuits | 1992

A low cost monolithic accelerometer

Steven J. Sherman; W.K. Tsang; Theresa A. Core; D.E. Quinn

The ADXL50, a complete scaled and temperature-compensated surface micromachined accelerometer with an output voltage proportional to acceleration with full-scale measurement range of +or-50 g and unpowered shock survival at 2000 g, is designed for crash detection in second-generation automotive air bag systems. A digitally activated self-test electrostatically deflects a functional beam so that a -50-g acceleration is indicated. An uncommitted amplifier, with rail-to-rail output range, allows rescaling and offsetting of the raw output signal. Capacitors can be introduced in the gain network surrounding the uncommitted amplifier so that two poles of low-pass filters are possible without the addition of off-chip active circuitry. Measured performance results for the ADXL50 are summarized.<<ETX>>


international solid-state circuits conference | 1995

Surface micromachining: from vision to reality to vision [accelerometer]

Richard S. Payne; Steven J. Sherman; S. Lewis; Roger T. Howe

Airbag deployment systems demand reliable, inexpensive sensing of deceleration of the car during collision. The integrated accelerometer combines a 0.3 mm/sup 2/ micromechanical capacitive sensing element with precision bipolar/MOS control circuitry in a 9 mm/sup 2/ area. The microstructure is fabricated from a layer of deposited polysilicon by surface micromachining. This chip is an A/V (acceleration-to-voltage) functional block for accelerations of 1 to 50 g. This paper reviews the rationale for surface micromachining the sensing element, the BiMOS2C integrated process, the sense and control circuit architecture, and performance of the chip.


international solid-state circuits conference | 2002

Single-chip surface-micromachined integrated gyroscope with 50/spl deg//hour root allan variance

John A. Geen; Steven J. Sherman; J.F. Chang; S.R. Lewis

A MEMS surface-micromachined gyroscope integrated on a single 3/spl times/3 mm/sup 2/ chip with a 3 /spl mu/m BiCMOS process has 4 /spl mu/m-thick polysilicon structure, 5V 6 mA power supply, 0.05/spl deg///spl radic/s spot noise, 12.5 mV//spl deg//s, >30,000 g shock survival, and -55 to 85/spl deg/C operating range.


Sensors and Actuators A-physical | 1994

A surface micromachined silicon accelerometer with on-chip detection circuitry

Wolfgang Kuehnel; Steven J. Sherman


Solid State Technology | 1993

Fabrication technology for an integrated surface-micromachined sensor

Theresa A. Core; W.K. Tsang; Steven J. Sherman


Archive | 1995

Monolithic micromechanical apparatus with suspended microstructure

Steven J. Sherman; Robert W. K. Tsang; Theresa A. Core; A. Paul Brokaw


Archive | 1993

Monolithic chip containing integrated circuitry and suspended microstructure

Steven J. Sherman; Robert W. K. Tsang; Theresa A. Core; A. Paul Brokaw


Archive | 1995

Method for adjusting sensitivity of a sensor

Steven J. Sherman


Archive | 1997

Conductive plane beneath suspended microstructure

Kevin H.-L. Chau; Roger T. Howe; Richard S. Payne; Yang Zhao; Theresa A. Core; Steven J. Sherman

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Mark Lemkin

University of California

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