Roger T. Howe

Laterally Driven Polysilicon Resonant Microstructures

Abstract Interdigitated finger (comb) structures are demonstrated to be effective for exciting electrostatically the resonance of polysilicon microstructures parallel to the plane of the substrate. Linear plates suspended by a folded-cantilever truss and torsional plates suspended by spiral and serpentine springs are fabricated from a 2 μm-thick phosphorus-doped low-pressure chemical-vapor-deposited (LPCVD) polysilicon film. Resonance is observed visually, with frequencies ranging from 18 kHz to 80 kHz and quality factors from 20 to 130. Simple beam theory is adequate for calculating the resonance frequencies, using a Youngs modulus of 140 GPa and neglecting residual strain in the released structures.

Critical Review: Adhesion in surface micromechanical structures

We present a review on the state of knowledge of surface phenomena behind adhesion in surface micromechanical structures. After introducing the problem of release-related and in-use adhesion, a theoretical framework for understanding the various surface forces that cause strong adhesion of micromechanical structures is presented. Various approaches are described for reducing the work of adhesion. These include surface roughening and chemical modification of polycrystalline silicon surfaces. The constraints that fabrication processes such as release, drying, assembly, and packaging place on surface treatments are described in general. Finally, we briefly outline some of the important scientific and technological issues in adhesion and friction phenomena in micromechanical structures that remain to be clarified.

Electrostatic-comb drive of lateral polysilicon resonators

This paper mvestlgates the elcctrostatlc dnve and sense of polynhcon resonators parallel to the substrate, using an mterdlgtated capacitor (electrostatic comb) Three expenmental methods are used nucroscoplc observation mth contmuous or stroboscopic iummatlon, capacltlve sensing using an amphtude-modulation technique and SEM observation The mtnnslc quality factor of the phosphorus-doped low-pressure chemlcal-vapordeposited (LPCVD) polyslhcon resonators is 49 000 + 2000, whereas at atmosphenc pressure, Q < 100 The finger gap IS found to have a more pronounced effect on comb charactenstlcs than finger width or length, as expected from simple theory

Microstructure to substrate self-assembly using capillary forces

We have demonstrated the fluidic self-assembly of micromachined silicon parts onto silicon and quartz substrates in a preconfigured pattern with submicrometer positioning precision. Self-assembly is accomplished using photolithographically defined part and substrate binding sites that are complementary shapes of hydrophobic self-assembled monolayers. The patterned substrate is passed through a film of hydrophobic adhesive on water, causing the adhesive to selectively coat the binding sites. Next, the microscopic parts, fabricated from silicon-on-insulator wafers and ranging in size from 150/spl times/150/spl times/15 /spl mu/m/sup 3/ to 400/spl times/400/spl times/50 /spl mu/m/sup 3/, are directed toward the substrate surface under water using a pipette. Once the hydrophobic pattern on a part comes into contact with an adhesive-coated substrate binding site, shape matching occurs spontaneously due to interfacial free energy minimization. In water, capillary forces of the adhesive hold the parts in place with an alignment precision of less than 0.2 /spl mu/m. Permanent bonding of the parts onto quartz and silicon is accomplished by activating the adhesive with heat or ultraviolet light. The resulting rotational misalignment is within /spl sim/0.3/spl deg/. Using square sites, 98-part arrays have been assembled in less than 1 min with 100% yield. The general microassembly approach described here may be applied to parts ranging in size from the nano- to milliscale, and part and substrate materials including semiconductors, glass, plastics, and metals.

Alkyltrichlorosilane-based self-assembled monolayer films for stiction reduction in silicon micromachines

We have investigated the potential of self-assembled monolayer (SAM) coatings for the purpose of adhesion reduction in microelectromechanical systems (MEMS). Two types of SAM coatings, derived from the precursor molecules octadecyltrichlorosilane [CH/sub 3/(CH/sub 2/)/sub 17/SiCl/sub 3/, OTS] and 1H,1H,2H,2H-perfluorodecyltrichlorosilane [CF/sub 3/(CF/sub 2/)/sub 7/(CH/sub 2/)/sub 2/SiCl/sub 3/, FDTS], were applied to polycrystalline silicon microstructures in a liquid-based process. Due to the hydrophobicity of these coatings, the water capillary forces responsible for the phenomenon known as release-related stiction are eliminated, and SAM-coated cantilever beams 2 /spl mu/m thick, 2 /spl mu/m above the substrate, and up to 2 mm in length emerge dry and free standing when removed from the final water rinse. The effects of SAM coating on adhesion encountered during device operation, termed in-use stiction, were characterized using arrays of cantilever beams of varying lengths. Structures made with a polycrystalline silicon of 3-nm rms roughness gave apparent works of adhesion of 30 and 8 /spl mu/J/m/sup 2/ for the OTS and FDTS SAM coatings, respectively, in comparison to 56 mJ/m/sup 2/ for standard oxide-coated structures. These results demonstrate that OTS coating reduces adhesion by more than three orders of magnitude over the conventional process and that the fluorinated SAM can lessen it further by four times. With regard to thermal stability, both SAM coatings can withstand heat treatment for 5 min at 450/spl deg/C in an N/sub 2/ ambient. In air, the OTS film begins to degrade at 150/spl deg/C while the fluorinated coating remains intact up to 400/spl deg/C. Therefore, both types of SAM coatings are compatible with several MEMS packaging techniques, with the FDTS monolayers exhibiting superior stiction and thermal stability properties to those derived from OTS. Furthermore, the FDTS formation does not require any chlorinated solvents such as carbon tetrachloride, which has been banned from industrial use, making the latter coating an industrially viable antistiction treatment.

An integrated CMOS micromechanical resonator high-Q oscillator

A completely monolithic high-Q oscillator, fabricated via a combined CMOS plus surface micromachining technology, is described, for which the oscillation frequency is controlled by a polysilicon micromechanical resonator with the intent of achieving high stability. The operation and performance of micromechanical resonators are modeled, with emphasis on circuit and noise modeling of multiport resonators. A series resonant oscillator design is discussed that utilizes a unique, gain-controllable transresistance sustaining amplifier. We show that in the absence of an automatic level control loop, the closed-loop, steady-state oscillation amplitude of this oscillator depends strongly upon the dc-bias voltage applied to the capacitively driven and sensed /spl mu/resonator. Although the high-Q of the micromechanical resonator does contribute to improved oscillator stability, its limited power-handling ability outweighs the Q benefits and prevents this oscillator from achieving the high short-term stability normally expected of high-Q oscillators.

Surface micromachined accelerometers

Surface micromachining has enabled the cofabrication of thin-film micromechanical structures and CMOS or bipolar/MOS integrated circuits. Using linear, single-axis accelerometers as a motivating example, this paper discusses the fundamental mechanical as well as the electronic noise floors for representative capacitive position-sensing interface circuits. Operation in vacuum lowers the Brownian noise of a polysilicon accelerometer to below 1 /spl mu/g//spl radic/(Hz). For improved sensor performance, the position of the microstructure should be controlled using electrostatic force-feedback. Both analog and digital closed-loop accelerometers are described and contrasted, with the latter using high-frequency voltage pulses to apply force quanta to the microstructure and achieve a very linear response.

Electrostatic Comb Drive Levitation And Control Method

This paper presents the theory, simulation results, and experimental study of the levitating force (normal to the substrate) associated with Interdigitated capacitor (electro static comb) lateral actuators. For compliant suspensions, normal displacements of over 2 /spl mu/m for a comb bias of 30 V are observed. This phenomenon is due to electrostatic attraction induced on top of the suspended structure. By electrically lsolating alternating drive-comb fingers and applying voltages of equal magnitude and opposite sign, levitation force can be reduced by an order of magnitude, while reducing the lateral drive force by less than a factor of 2. The levitation theory incorporates electrostatic simulation results, and agrees well with experimental data.

Surface micromachining for microsensors and microactuators

Micromechanical structures can be made by selectively etching sacrificial layers from a multilayer sandwich of patterned thin films. This paper reviews this technology, termed surface micromachining, with an emphasis on polysilicon microstructures. Micromechanical characteristics of thin‐film microstructures critically depend on the average residual stress in the film, as well as on the stress variation in the direction of deposition. The stress in low‐pressure chemical vapor deposition polysilicon varies with deposition temperature, doping, and annealing cycles. Applications of surface micromachining to fabricate beams, plates, sealed cavities, and linear and rotary bearings are discussed.

Microelectromechanical filters for signal processing

Microelectromechanical (MEM) filters based on coupled, lateral microresonators are demonstrated. This class of MEM systems has potential signal-processing applications for filters which require narrow bandwidth (high Q), good signal-to-noise ratio (SNR) and stable temperature and aging characteristics. Both series and parallel filters were fabricated and tested using an off-chip modulation technique. The frequency range of these filters is from approximately 5 kHz to on the order of 1 MHz, for polysilicon microstructures with suspension beams having a 2- mu m-square cross section. A series-coupled resonator pair, designed for operation at atmospheric pressure, has a measured center frequency of 18.7 kHz and a bandwidth of 1.2 kHz.<<ETX>>