Steven Taniselass

Wire Bond Shear Test Simulation on Sharp Groove Surface Bond Pad

Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded wires. Hence, in this study thesimulation on wire bond shear test is performed on a sharp groove surface bond pad. ANSYS ver 11 was used to perform the simulation. The stress response of the bonded wires are investigated.The effects of three wire materials gold(Au), aluminum(Al) and copper(Cu) on the stress response during shear test were examined. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response.

Polymer Core BGA Stress Analysis at Minimal Vertical Loading

Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress response of BGA solder ball during minimum vertical loading is analyzed through simulation. The stress response between two types of solder ball, Normal BGA and Micropearl BGA are compared. The Micropearl BGA is a solder ball which contains polymer core. The vertical loading forces used were 1N and 3N. A commercial computational software ANSYS was used for the simulation. The simulation results showed that the Normal BGA exhibited higher stress response.

Shear Ram Height Investigation for Gold Wire Bond Shear Test

This paper presents the simulation of gold wire bond shear test. The stress and strain response of the gold ball bond during wire bond shear was examined. The simulation was done using a A 3D non-linear finite element model. The effects of the shear ram height on the stress and strain response of the gold ball bond were investigated. The results of the simulation confirms that shear ram height has a significant effect on the von mises stress and equivalent strain response of the gold ball bond during wire bond shear test.

Battery energy storage system assessment in a designed battery controller for load leveling and peak shaving applications

This paper presents an assessment of three types of battery in a designed battery controller for a battery energy storage system (BESS) integrated with a solar photovoltaic system for load leveling and peak shaving applications. Three types of battery—lead acid, lithium ion, and nickel metal hydride—are discussed in detail and assessed in this work, focusing on small-scale integration. The controller was designed using Matlab Simulink to monitor consumer load demand, control the charging and discharging process of the BESS, and regulate while fulfilling the load demand, in addition to prolonging the BESS lifetime. From the simulation results, the nickel metal hydride battery is the best option for development of a battery controller. It achieved an average 37.45% leveled load profile and a 35.75% reduction of the load peak. However, the lead acid battery is still the dominant choice among consumers, in spite of average performance, because it has the best cost performance.

Quantum well thickness variation investigation on optical and thermal performances of GaN LEDs

Blue InGaN LED suffers from a severe efficiency droop at high current density and electron leakage is believed to be one of the primary causes of it. In this study, InGaN LED was simulated using Sentaurus TCAD. The effects of thickness of the quantum wells on the device performances were examined through simulation. Results of the simulations suggested that to achieve a low efficiency droop, the wells have to be thick.

A Review on Various Load Control Strategies for Battery Energy Storage System in Energy Applications

Battery Energy Storage System (BESS) is one of the most popular and established options used to decouple the timing of generation and consumption of electric energy. In spite of variety types of energy storage exists, BESS has proven to be widely used in these three main energy applications, which are Renewable Energy (RE) integration, load leveling and peak shaving. Concurrently, managing stored energy and generated power is a real challenge where the load control system plays the decisive role to ensure better energy management efficiency with stabilized and guaranteed energy supply. This paper presents an analysis of various load control algorithms and methods used, integrated with BESS to achieve the required output. Besides that, recent research works are also summarized in this paper. Based on the study, battery State of Charge (SOC) is widely and mainly used in the load control algorithm and proven as effective and reliable load control strategy.

WSS Investigation in Microfluidic FFS Channel at Re 500

Wall shear stress (WSS) is one of the important variables in microfluidic devices. In this paper WSS distribution for a microfluidic device in Forward Facing Step (FFS) configuration has been investigated using Reynolds number 500 and step height 1μm. Numerical simulation was performed usingAnsys-CFX software with the assumption of Newtonian fluid and laminar condition. The simulation result showed that wall shear stress distribution increased after the fluid passing through the step.

Shear Ram Speed Characterization for Copper Wire Bond Shear Test

This paper presents the evaluation of the stress and strain response of the copper ball bond during wire bond shear test using finite element analysis. A 3D non-linear finite element model was developed for the simulation. The effects of the shear ram speed on the stress and strain response of the copper ball bond were investigated. A preliminary investigation confirms that shear ram speed has a significant effect on the von mises stress and equivalent strain response of the copper ball bond during wire bond shear test

Validation of thermal effects of LED package by using Elmer finite element simulation method

The overall performance of the Light-emitting diode, LED package is critically affected by the heat attribution. In this study, open source software - Elmer FEM has been utilized to study the thermal analysis of the LED package. In order to perform a complete simulation study, both Salome software and ParaView software were introduced as Pre and Postprocessor. The thermal effect of the LED package was evaluated by this software. The result has been validated with commercially licensed software based on previous work. The percentage difference from both simulation results is less than 5% which is tolerable and comparable.

A comparative study of thermal performance on commercialized LED bulb on the luminaire geometry

The demand for the high Lumens output on the commercialized Light-emitting diode, LED bulb has resulted in the increase of operating power and generation of heat. A study on the thermal performance of commercialized LED bulbs was done by using Elmer finite element simulation method. The variation approach was limited to input power (2 Watt- 10 Watt) and the heat performance was compared. The result gives a comparison of the variation of the model and the heat distribution. Analysis showed that the input power and bulb geometry give direct effect on the junction temperature.