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Dive into the research topics where Sumio Yoshioka is active.

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Featured researches published by Sumio Yoshioka.


Mechanical Behaviour of Materials VI#R##N#Proceedings of the Sixth International Conference, Kyoto, Japan, 29 July℃2 August 1991 | 1992

EVALUATION OF FATIGUE DAMAGE IN SOLDER JOINTS OF ELECTRONIC DEVICES

Y. Uegai; Shuichi Tani; Sumio Yoshioka; Akio Inoue; J. Hirota

ABSTRACT This paper proposes the evaluation method of fatigue damage (fatigue crack length) in solder joints of electronic devices. The fatigue damage is evaluated by means of the residual strength obtained by the peeling test of cracked solder joint after mechanical fatigue test. The observation of fracture surface of solder joints are carried out by scanning electron microscope (SEM) in order to investigate the relationship between the residual strength and fatigue crack length. Moreover, the residual strength of cracked solder joints is estimated by the finite element analysis. The test and analysis are carried out for the surface mount IC packages. It is found that the fatigue damage in solder joints can be evaluated by the peeling test and the finite element analysis is available for the estimation of the residual strength.


Journal of The Society of Materials Science, Japan | 2002

Proposal of Standard Regression Method for S-N Curve Based on Fatigue Test Data for Metallic Materials(Special Issue on Reliability Engineering)

Izuru Nishikawa; Hidetoshi Nakayasu; Atsushi Sugeta; Toshinori Yokomaku; Sumio Yoshioka; Toshio Shuto; Tomofumi Shintani; Takashi Sakai; Tatsuo Sakai


Transactions of the Japan Society of Mechanical Engineers. A | 1989

Boundary element analysis of steady-state heat conduction and thermal stresses in the LSI package.

Mitsuru Sato; Ryoji Yuuki; Sumio Yoshioka


Transactions of the Japan Society of Mechanical Engineers. A | 1994

Analyses of Delamination Arrest Effect of Dimples on Interface in LSI Package.

Mitsuru Sato; Ryoji Yuuki; Akio Inoue; Shuichi Tani; Sumio Yoshioka; Makoto Iwaoka


Transactions of the Japan Society of Mechanical Engineers. A | 1995

Evaluation Method of Thermal Fatigue Life for Surface-Mount Solder Joints by Mechanical Fatigue Test.

Yasumi Uegai; Shuichi Tani; Akio Inoue; Sumio Yoshioka; Shinji Badono; Akemi Hijikata


Transactions of the Japan Society of Mechanical Engineers. A | 1992

Boundary Element Heat Conduction and Thermoelastic Analyses of Interface Crack in LSI Package in Consideration of Contact Between Crack Surfaces.

Mitsuru Sato; Ryoji Yuuki; Sumio Yoshioka


JSME international journal. Series 1, solid mechanics, strenght of materials | 1990

Boundary Element Analysis of Steady-State Heat Conduction and Thermal Stress in the LSI Package

Mitsuru Sato; Ryoji Yuuki; Sumio Yoshioka


Journal of The Society of Materials Science, Japan | 1989

Fatigue crack growth rate of structural materials for cryogenic use.

Akio Inoue; Shuichi Tani; Sumio Yoshioka; Akinori Ueda; Tadatoshi Takayanagi; Masahiro Ohno; Junji Ishizaka


Tetsu To Hagane-journal of The Iron and Steel Institute of Japan | 1987

Mechanical Properties and Low Cycle Fatigue Strength at 4 and 300 K of Welded Alloy A286

Keijiro Hiraga; Toshio Ogata; Kotobu Nagai; Tetsumi Uri; Keisuke Ishikawa; Sumio Yoshioka; Akio Inoue; Sadatoshi Takayanagi


Journal of The Society of Materials Science, Japan | 1998

A Study of Influencing Factors on Mechanical Strength of Cathode Ray Tubes.

Shigeo Ohsugi; Sumio Yoshioka; Masayuki Miyazaki; Junko Itoh; Shuichi Tani; Koji Nakamura

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Akemi Hijikata

Kanazawa Institute of Technology

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Yasuhiro Yabe

Mitsubishi Research Institute

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