Susanne Arney

Effects of electrical leakage currents on MEMS reliability and performance

Electrostatically driven MEMS devices commonly operate with electric fields as high at 10/sup 8/ V/m applied across the dielectric between electrodes. Even with the best mechanical design, the electrical design of these devices has a large impact both on performance (e.g., speed and stability) and on reliability (e.g., corrosion and dielectric or gas breakdown). In this paper, we discuss the reliability and performance implications of leakage currents in the bulk and on the surface of the dielectric insulating the drive (or sense) electrodes from one another. Anodic oxidation of poly-silicon electrodes can occur very rapidly in samples that are not hermetically packaged. The accelerating factors are presented along with an efficient early-warning scheme. The relationship between leakage currents and the accumulation of quasistatic charge in dielectrics are discussed, along with several techniques to mitigate charging and the associated drift in electrostatically actuated or sensed MEMS devices. Two key parameters are shown to be the electrode geometry and the conductivity of the dielectric. Electrical breakdown in submicron gaps is presented as a function of packaging gas and electrode spacing. We discuss the tradeoffs involved in choosing gap geometries and dielectric properties that balance performance and reliability.

Lucent Microstar micromirror array technology for large optical crossconnects

Electrostatically actuated, 500micrometers diameter, Si surface micromachined 2-axis tilting micromirrors were designed and fabricated in a 2 structural + 1 interconnect layer polysilicon process. The mirrors are capable of large, continuous, controlled, DC tilt in any direction at moderate actuation voltages. The lowest-mode resonance frequency is sufficiently high to decouple from the ambient vibration noise and allow setting times of less than a few milliseconds. The Au- coated reflectors, suspended in gimbal mounts via torsional springs and bearings, are tilted by applying voltage to four electrically independent sets of fixed electrodes on the substrate. The electrodes and the springs are designed to optimize actuation voltages, resonance frequencies and the deflection range. To achieve the range, the mounts are lifted and fixed fifty microns above the substrate surface during the release process by a self-assembly mechanism powered by tailored residual stress in a separate metalization layer. Square arrays with 1 mm pitch containing independently addressable identical 16, 64 and 256 mirrors were fabricated and hermetically packaged. Based on these devices, fully functional, bitrate and wavelength independent, single stage, low insertion loss, single mode fiber optical crossconnect system are built.

Fabrication of a mechanical antireflection switch for fiber-to-the-home systems

We present the methods used to fabricate a micromechanical silicon optical modulator for use in a fiber-to-the-home applications. We emphasize the efforts made to realize a practical, robust, manufacturable, and easily packaged device. In addition, recent speed, temperature stability, and reliability results are presented. Rise and fall times of 132 and 125 ns, respectively, have been observed in response to a square wave drive signal. The device has been temperature cycled from -50/spl deg/C to 90/spl deg/C and shown greater than 10-dB optical contrast ratio over this temperature range. Finally, the device has been cycled at 500 kHz for a period of nearly two months (two-trillion cycles) without a noticeable loss in performance.

Anodic oxidation and reliability of MEMS polysilicon electrodes at high relative humidity and high voltages

We present a full factorial study of the effect of relative humidity and voltage on the oxidation of surface-micromachined poly-silicon wiring and electrodes. Our system consists of 500 nm thick poly-Si wires and electrodes insulated from the substrate wafer by 600 nm of Si-rch SixNy, fabricated using a surface-micromachinging process. In dry ambients, oxidation or damage to the bottom poly-Si layer (the Poly0 layer) in MicroElectroMechanical Systems (MEMS) devices occurs so slowly that little can be learned in a timely manner, even when stressing the electrodes at electric fields close to dielectric breakdown. We observe however that in ambient with elevated relative humidity the Poly0 wires and electrodes anodically oxidize within a short period of time when operated at moderately large voltages. Only the most positively biased poly-Si structures oxidize, and we describe the anodic oxidation and association volume expansion as a function of a number of accelerating factors including relative humidity and voltage. A threshold is observed in relative humidity bot not in voltage.

Optical MEMS devices for telecom systems

As telecom networks increase in complexity there is a need for systems capable of manage numerous optical signals. Many of the channel-manipulation functions can be done more effectively in the optical domain. MEMS devices are especially well suited for this functions since they can offer large number of degrees of freedom in a limited space, thus providing high levels of optical integration. We have designed, fabricated and tested optical MEMS devices at the core of Optical Cross Connects, WDM spectrum equalizers and Optical Add-Drop multiplexors based on different fabrication technologies such as polySi surface micromachining, single crystal SOI and combination of both. We show specific examples of these devices, discussing design trade-offs, fabrication requirements and optical performance in each case.

Mechanical reliability of surface-micromachined self-assembling two-axis MEMS tilting mirrors

The PolytecTM laser Doppler vibrometer was used to characterize the dynamics mechanical reliability and lifetimes of surface-micromachined self-assembling MEMS tilting mirrors. The mechanical modes of micromirror can be identified and corresponding resonance frequencies measured. It was found, for certain experimental conditions, that micromirror operation simulating contact between poly-Si surfaces may result in device lifetime reduction due to stiction at the point of contact. The appropriate modifications in device design eliminate the effect of stiction on device lifetime. Moreover, for up to 109 mechanical cycles completed no friction-related device degradation has been observed. In controlled dry ambient at room temperature, micromirrors have been able to complete about 2x1010 switching operations without signs of mechanical degradation. The results validate the robustness and long term mechanical ability of evaluated micromirror devices.

A 1.5 Mb/s operation of a MARS device for communications systems applications

We present the fabrication and performance of a Si MARS (mechanical antireflection switch) micromechanical optical modulator for fiber-in-the-loop applications. Device performance is reported showing rise and fall times of less than 100 ns, greater than 10 dB optical contrast ratio at ambient temperatures from -50 to 90/spl deg/C, and evidence of reliability exhibited in operation at 500 kHz for over two months (two trillion cycles) without noticeable loss in performance. Bit error rate measurements show potential performance at 1.5 Mb/s with a 10/sup -9/ bit error rate. Emphasis is placed on our efforts to produce a device which is practical, robust, and inexpensive to manufacture and package.

Design for reliability of MEMS/MOEMS for lightwave telecommunications

Optical Micro-Electro-Mechanical Systems (Optical MEMS, or MOEMS) comprise a disruptive technology whose application to telecommunications networks is transforming the horizon for lightwave systems. The influences of materials systems, processing subtleties, and reliability requirements on design flexibility, functionality and commercialization of MOEMS are complex. A tight inter-dependent feedback loop between Component/ Subsystem/ System Design, Fabrication, Packaging, Manufacturing and Reliability is described as a strategy for building reliability into emerging MOEMS products while accelerating their development into commercial offerings.

Electrical and environmental reliability characterization of surface micromachined MEMS polysilicon test structures

While considerable press has been given to characterization of mechanical properties of MicroElectroMechanical Systems (MEMS) as related to reliability, environmental robustness, and lifetimes studies, characterization of electrical properties of MEMS have not been widely published. In this paper we present an examination of electrical properties (surface and substrate leakage currents, sheet resistance, substrate contact resistance and interlayer contact resistances) of polysilicon thin films used in surface micromachined MEMS test structures. Environmental and electrical overstress conditions that affect leakage have been studied. Two test structures have been used to independently study surface and substrate leakage currents at different levels of humidity (0% to 80% RH) and applied voltage (100 to 150 volts). Both static and lifetime studies have been conducted. Significant differences in surface and substrate leakage lifetime characteristics are observed, suggesting different failure mechanisms for these two important electrical phenomena in MEMS reliability.

Closed-loop AO demonstration of MEMS SLM with piston, tip, and tilt control

A MEMS SLM with an array of 64×64 pixels, each 120 μm ×120 μm in size, with 98% fill-factor, has been developed. Each reflector in the array is capable of 5 μm of stroke, and ±4° tip and tilt. From a prototype array, 14 contiguous pixels have been independently wired-out to off-chip drive electronics. These 14 pixels have been demonstrated to be effective in an off-the-shelf AO system (with requisite modifications to suit the SLM). For a low-order static aberration, the measured Strehl ratio has been improved from 0.069 to 0.861, a factor of 12 improvement.