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Dive into the research topics where Susumu Iwai is active.

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Featured researches published by Susumu Iwai.


Archive | 1994

Air-cooled information processing apparatus having cooling air fan, sub-fan, and plural separated cooling air flow channels

Toshihiro Komatsu; Hitoshi Matsushima; Toshio Hatada; Susumu Iwai; Tetsuro Homma; Yoshihiro Kondo; Shouhei Fuse; Hiroshi Yamada; Kazuo Morita; Hiroshi Ito; Akiyoshi Iida; Kenta Kumagai; Shinichi Shimode


Archive | 1989

Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system

Toshio Hatada; Takayuki Atarashi; Takahiro Daikoku; Satomi Kobayashi; Shizuo Zushi; Fumiyuki Kobayashi; Susumu Iwai


Archive | 1992

Packaging structure of small-sized computer

Toshio Hatada; Hiroshi Inouye; Takao Ohba; Susumu Iwai


Archive | 2009

Substrate inspection device and substrate inspection method

Susumu Iwai; Noboru Kato


Applied Thermal Engineering | 1995

Electronic equipment and lap-top type electronic equipment

Shigeo Ohashi; Toshio Hatada; Takeo Tanaka; Susumu Iwai


Archive | 1994

Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon

Hitoshi Matsushima; Toshihiro Komatu; Yoshihiro Kondou; Toshio Hatada; Susumu Iwai; Tetsuro Honma; Toshiki Iino; Takao Ohba; Akira Yamagiwa


Archive | 1993

LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted

Masatsugu Arai; Akiomi Kohno; Toshio Hatada; Yoshihiro Kondo; Toshihiro Komatsu; Kanji Otsuka; Yuji Shirai; Susumu Iwai


Archive | 1993

Electronic apparatus equipment and lap top electronic apparatus equipment

Toshio Hatada; Susumu Iwai; Shigeo Ohashi; Takeo Tanaka; 繁男 大橋; 進 岩井; 武雄 田中; 敏夫 畑田


Archive | 1997

Air cooled electronic equipment apparatus

Yoshihiro Kondou; Tadakatsu Nakajima; Shigeo Ohashi; Susumu Iwai; Masayoshi Miyazaki; Shoohei Fuse; Kazuo Morita; Hidetada Fukunaka


Archive | 1996

Heat dissipation structure in a portable computer including a heat dissipation block extending from a heat dissipation plate through a first circuit board to a CPU on a second circuit board

Tsuyoshi Nakagawa; Yasushi Neho; Naoyuki Sakamoto; Shigeo Ohashi; Yoshito Ohmura; Yukiko Iwama; Tadakatsu Nakajima; Yoshihiro Kondo; Susumu Iwai; Hitoshi Matsushima

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