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Szu Wei Lu

TSMC

Publication

Featured researches published by Szu Wei Lu.

Archive | 2005

Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads

Szu Wei Lu; Hsin-Hui Lee; Chung Yu Wang; Mirng-Ji Lii

Archive | 2006

Electromagnetic shielding using through-silicon vias

Clinton Chao; Chao-Shun Hsu; Mark Shane Peng; Szu Wei Lu; Tjandra Winata Karta

Archive | 2005

Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade

Szu Wei Lu; Hsin-Hui Lee; Ming-Chung Sung; Mirng-Ji Lii

Archive | 2009

Semiconductor device including electrically conductive bump and method of manufacturing the same

Clinton Chao; Pei-Haw Tsao; Szu Wei Lu; Tjandra Winata Karta

Archive | 2006

Silicon-Based Thin Substrate and Packaging Schemes

Szu Wei Lu; Clinton Chao; Ann Luh; Tjandra Winata Karta; Jerry Tzou; Kuo-chin Chang

Archive | 2006

Stratified underfill in an IC package

Mirng-Ji Lii; Szu Wei Lu; Tjandra Winata Karta; Chien-Hsiun Lee

Archive | 2011

Integrated Circuit Having Stress Tuning Layer and Methods of Manufacturing Same

Shin-puu Jeng; Clinton Chao; Szu Wei Lu

Archive | 2008

Contact pad and bump pad arrangement for high-lead or lead-free bumps

Szu Wei Lu; Hsin-Hui Lee; Chung Yu Wang; Mirng-Ji Lii

Archive | 2007

Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer

Szu Wei Lu; Hsin-Hui Lee; Ming-Chung Sung; Mirng-Ji Lii

Archive | 2012

Integrated circuit having stress tuning layer

Shin-puu Jeng; Clinton Chao; Szu Wei Lu

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