Szu Wei Lu

Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads

Electromagnetic shielding using through-silicon vias

Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade

Semiconductor device including electrically conductive bump and method of manufacturing the same

Silicon-Based Thin Substrate and Packaging Schemes

Stratified underfill in an IC package

Integrated Circuit Having Stress Tuning Layer and Methods of Manufacturing Same

Contact pad and bump pad arrangement for high-lead or lead-free bumps

Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer

Integrated circuit having stress tuning layer