T. Jenkins

Comparison of gate and drain current detection of hydrogen at room temperature with AlGaN∕GaN high electron mobility transistors

Pt-gated AlGaN∕GaN high electron mobility transistors can be used as room-temperature hydrogen gas sensors at hydrogen concentrations as low as 100ppm. A comparison of the changes in drain and gate current-voltage (I-V) characteristics with the introduction of 500ppm H2 into the measurement ambient shows that monitoring the change in drain-source current provides a wider gate voltage operation range for maximum detection sensitivity and higher total current change than measuring the change in gate current. However, over a narrow gate voltage range, the relative sensitivity of detection by monitoring the gate current changes is up to an order of magnitude larger than that of drain-source current changes. In both cases, the changes are fully reversible in <2–3min at 25°C upon removal of the hydrogen from the ambient.

Effects of Sc 2 O 3 and MgO passivation layers on the output power of AlGaN/GaN HEMTs

The low temperature (100/spl deg/C) deposition of Sc/sub 2/O/sub 3/ or MgO layers is found to significantly increase the output power of AlGaN/GaN HEMTs. At 4 GHz, there was a better than 3 dB increase in output power of 0.5/spl times/100 /spl mu/m/sup 2/ HEMTs for both types of oxide passivation layers. Both Sc/sub 2/O/sub 3/ and MgO produced larger output power increases at 4 GHz than conventional plasma-enhanced chemical vapor deposited (PECVD) SiN/sub x/ passivation which typically showed /spl les/2 dB increase on the same types of devices. The HEMT gain also in general remained linear over a wider input power range with the Sc/sub 2/O/sub 3/ or MgO passivation. These films appear promising for reducing the effects of surface states on the DC and RF performance of AlGaN/GaN HEMTs.

Improved morphology for ohmic contacts to AlGaN/GaN high electron mobility transistors using WSix- or W-based metallization

A comparison was made of specific contact resistivity and morphology of Ti/Al/Pt/WSi/Ti/Au and Ti/Al/Pt/W/Ti/Au ohmic contacts to AlGaN/GaN heterostructures relative to the standard Ti/Al/Pt/Au metallization. The W- and WSi-based contacts show comparable specific resistivities to that of the standard contact on similar layer structures, reaching minimum values of ∼10−5 Ω cm2 after annealing in the range 850–900 °C. However, the W- and WSi-based contacts exhibit much smoother surface morphologies, even after 950 °C annealing. For example, the root-mean-square roughness of the Ti/Al/Pt/WSi/Ti/Au contact annealed at 950 °C was unchanged from the as-deposited values whereas the Ti/Al/Pt/Au contact shows significant deterioration of the morphology under these conditions. The improved thermal stability of the W- and WSix-based contacts is important for maintaining edge acuity during high-temperature operation.A comparison was made of specific contact resistivity and morphology of Ti/Al/Pt/WSi/Ti/Au and Ti/Al/Pt/W/Ti/Au ohmic contacts to AlGaN/GaN heterostructures relative to the standard Ti/Al/Pt/Au metallization. The W- and WSi-based contacts show comparable specific resistivities to that of the standard contact on similar layer structures, reaching minimum values of ∼10−5 Ω cm2 after annealing in the range 850–900 °C. However, the W- and WSi-based contacts exhibit much smoother surface morphologies, even after 950 °C annealing. For example, the root-mean-square roughness of the Ti/Al/Pt/WSi/Ti/Au contact annealed at 950 °C was unchanged from the as-deposited values whereas the Ti/Al/Pt/Au contact shows significant deterioration of the morphology under these conditions. The improved thermal stability of the W- and WSix-based contacts is important for maintaining edge acuity during high-temperature operation.

Proton irradiation of MgO- or Sc2O3 passivated AlGaN/GaN high electron mobility transistors

Abstract AlGaN/GaN high electron mobility transistors with either MgO or Sc 2 O 3 surface passivation were irradiated with 40 MeV protons at a dose of 5×10 9 cm −2 . While both forward and reverse bias current were decreased in the devices as a result of decreases in channel doping and introduction of generation–recombination centers, there was no significant change observed in gate lag measurements. By sharp contrast, unpassivated devices showed significant decreases in drain current under pulsed conditions for the same proton dose. These results show the effectiveness of the oxide passivation in mitigating the effects of surface states present in the as-grown structures and also of surface traps created by the proton irradiation.

Improved dc and power performance of AlGaN/GaN high electron mobility transistors with Sc2O3 gate dielectric or surface passivation

Abstract The dc and power characteristics of AlGaN/GaN MOS-HEMTs with Sc2O3 gate dielectrics were compared with that of conventional metal-gate HEMTs fabricated on the same material. The MOS-HEMT shows higher saturated drain–source current (∼0.75 A/mm) and significantly better power-added efficiency (PAE, 27%) relative to the HEMT (∼0.6 A/mm and ∼5%). The Sc2O3 also provides effective surface passivation, with higher drain current, lower leakage currents and higher three-terminal breakdown voltage in passivated devices relative to unpassivated devices. The PAE also increases (from ∼5% to 12%) on the surface passivated HEMTs, showing that Sc2O3 is an attractive option for reducing gate and surface leakage in AlGaN/GaN heterostructure transistors.

The role of cleaning conditions and epitaxial layer structure on reliability of Sc2O3 and MgO passivation on AlGaN/GaN HEMTS

Abstract The effect of layer structure (GaN versus AlGaN cap) and cleaning procedure prior to Sc2O3 or MgO deposition at 100 °C were examined for their effects on the long-term bias-stress stability of AlGaN/GaN high electron mobility transistors (HEMTs). Surface cleaning by itself was not sufficient to prevent current collapse in the devices. The forward and reverse gate leakage currents were decreased under most conditions upon deposition of the oxide passivation layers. After ≈13 h of bias-stressing, the MgO-passivated HEMTs retain ⩾90% their initial drain–source current. The Sc2O3-passivated devices retained ∼80% recovery of the current under the same conditions.

Xs-MET-a reduced complexity fabrication process using complementary heterostructure field effect transistors for analog, low power, space applications

The requirements for space-based integrated circuit applications are defined with an emphasis on being radiation tolerant and low power consuming. Flexible analog signal processors (FASPs) are outlined as a means by which effective circuit designs can be utilized to perform a multitude of tasks. The development of complementary III-V technologies have been proven to meet the demands of the space environment, and have demonstrated the potential for frequency operation beyond 1 GHz using power supply voltages at or below 1.5 Volts. The novel fabrication process known as Xs-MET (pronounced kismet, which uses the Creek letter chi, X, and stands for Complementary Heterostructure Integrated Single Metal Transistor), is introduced as a manufacturing technique to be used in FASP design. The Xs-MET fabrication process is outlined with preliminary device results presented. An example of a FASP circuit design using Xs-MET is provided. Conclusions regarding the utilization of the Xs-MET process for FASPs are outlined with comments focusing on a space-based demonstration.