James K. Gillespie

Short-Channel Effect Limitations on High-Frequency Operation of AlGaN/GaN HEMTs for T-Gate Devices

AlGaN/GaN high-electron mobility transistors (HEMTs) were fabricated on SiC substrates with epitaxial layers grown by multiple suppliers and methods. Devices with gate lengths varying from 0.50 to 0.09 mum were fabricated on each sample. We demonstrate the impact of varying the gate lengths and show that the unity current gain frequency response (fT) is limited by short-channel effects for all samples measured. We present an empirically based physical model that can predict the expected extrinsic fT for many combinations of gate length and commonly used barrier layer thickness (tbar) on silicon nitride passivated T-gated AlGaN/GaN HEMTs. The result is that even typical high-aspect-ratio (gate length to barrier thickness) devices show device performance limitations due to short-channel effects. We present the design tradeoffs and show the parameter space required to achieve optimal frequency performance for GaN technology. These design rules differ from the traditional GaAs technology by requiring a significantly higher aspect ratio to mitigate the short-channel effects.

AlGaN/GaN metal-oxide-semiconductor high electron mobility transistors using Sc2O3 as the gate oxide and surface passivation

We demonstrated that Sc2O3 thin films deposited by plasma-assisted molecular-beam epitaxy can be used simultaneously as a gate oxide and as a surface passivation layer on AlGaN/GaN high electron mobility transistors (HEMTs). The maximum drain source current, IDS, reaches a value of over 0.8 A/mm and is ∼40% higher on Sc2O3/AlGaN/GaN transistors relative to conventional HEMTs fabricated on the same wafer. The metal–oxide–semiconductor HEMTs (MOS–HEMTs) threshold voltage is in good agreement with the theoretical value, indicating that Sc2O3 retains a low surface state density on the AlGaN/GaN structures and effectively eliminates the collapse in drain current seen in unpassivated devices. The MOS-HEMTs can be modulated to +6 V of gate voltage. In particular, Sc2O3 is a very promising candidate as a gate dielectric and surface passivant because it is more stable on GaN than is MgO.

Wet Chemical Digital Etching of GaAs at Room Temperature

A new room temperature wet chemical digital etching technique for GaAs is presented which uses hydrogen peroxide and an acid in a two‐step etching process to remove GaAs in approximately 15 A increments. In the first step, GaAs is oxidized by 30% hydrogen peroxide to form an oxide layer that is diffusion limited to a thickness of 14 to 17 A for time periods from 15 to 120 s. The second step removes this oxide layer with an acid that does not attack unoxidized GaAs. These steps are repeated in succession until the desired etch depth is obtained. Experimental results are presented for this digital etching technique demonstrating the etch rate and process invariability with respect to hydrogen peroxide and acid exposure times.

High-Power Ka-Band Performance of AlInN/GaN HEMT With 9.8-nm-Thin Barrier

We report the first CW Ka-band radio-frequency (RF) power measurements at 35 GHz from a passivated Al_0.82In_0.18N/GaN high-electron mobility transistor on SiC with 9.8-nm-thin barrier. This device delivered a maximum of 5.8 W/mm with a power-added efficiency of 43.6% biased at V_DS = 20 V and 10% I_DSS when matched for power at CW. The device was grown by metal-organic chemical vapor deposition with 2.8-¿m source-drain spacing and a gate length of 160 nm. An excellent ohmic contact was obtained with an R_c of 0.62 ¿·mm. The maximum extrinsic transconductance was 354 mS/mm with an I_DSS of 1197 mA/mm at a V_GS of 0 V, an ft of 79 GHz, and an f_max of 113.8 GHz.

Full-Wafer Characterization of AlGaN/GaN HEMTs on Free-Standing CVD Diamond Substrates

We report on electrical characterization and uniformity measurements of the first conventionally processed AlGaN/GaN high electron mobility transistors (HEMTs) on free-standing chemical-vapor-deposited (CVD) diamond substrate wafers. DC and RF device performance is reported on HEMTs fabricated on ~ 130-¿m-thick and 30-mm round CVD diamond substrates without mechanical carrying wafers. A measured fT ·LG product of 12.5 GHz ·¿m is the best reported data for all GaN-on-diamond technology. X-band power performance of AlGaN/GaN HEMTs on diamond is reported to be 2.08 W/mm and 44.1% power added efficiency. This letter demonstrates the potential for GaN HEMTs to be fabricated on CVD diamond substrates utilizing contact lithography process techniques. Further optimization of the epitaxy and diamond substrate attachment process could provide for improvements in thermal spreading while preserving the electrical properties.

Comparison of gate and drain current detection of hydrogen at room temperature with AlGaN∕GaN high electron mobility transistors

Pt-gated AlGaN∕GaN high electron mobility transistors can be used as room-temperature hydrogen gas sensors at hydrogen concentrations as low as 100ppm. A comparison of the changes in drain and gate current-voltage (I-V) characteristics with the introduction of 500ppm H2 into the measurement ambient shows that monitoring the change in drain-source current provides a wider gate voltage operation range for maximum detection sensitivity and higher total current change than measuring the change in gate current. However, over a narrow gate voltage range, the relative sensitivity of detection by monitoring the gate current changes is up to an order of magnitude larger than that of drain-source current changes. In both cases, the changes are fully reversible in <2–3min at 25°C upon removal of the hydrogen from the ambient.

Effects of Sc 2 O 3 and MgO passivation layers on the output power of AlGaN/GaN HEMTs

The low temperature (100/spl deg/C) deposition of Sc/sub 2/O/sub 3/ or MgO layers is found to significantly increase the output power of AlGaN/GaN HEMTs. At 4 GHz, there was a better than 3 dB increase in output power of 0.5/spl times/100 /spl mu/m/sup 2/ HEMTs for both types of oxide passivation layers. Both Sc/sub 2/O/sub 3/ and MgO produced larger output power increases at 4 GHz than conventional plasma-enhanced chemical vapor deposited (PECVD) SiN/sub x/ passivation which typically showed /spl les/2 dB increase on the same types of devices. The HEMT gain also in general remained linear over a wider input power range with the Sc/sub 2/O/sub 3/ or MgO passivation. These films appear promising for reducing the effects of surface states on the DC and RF performance of AlGaN/GaN HEMTs.

Comparison of Surface Passivation Films for Reduction of Current Collapse in AlGaN/GaN High Electron Mobility Transistors

Three different passivation layers (SiN x , MgO, and Sc 2 O 3 ) were examined for their effectiveness in mitigating surface-state-induced current collapse in AlGaN/GaN high electron mobility transistors (HEMTs). The plasma-enhanced chemical vapor deposited SiN x produced ∼70-75% recovery of the drain-source current, independent of whether SIH 4 /NH 3 or SiD 4 /ND 3 plasma chemistries were employed. Both the Sc 2 O 3 and MgO produced essentially complete recovery of the current in GaN-cap HEMT structures and ∼80-90% recovery in AlGaN-cap structures. The Sc 2 O 3 had superior long-term stability, with no change in HEMT behavior over 5 months aging.

Improved morphology for ohmic contacts to AlGaN/GaN high electron mobility transistors using WSix- or W-based metallization

A comparison was made of specific contact resistivity and morphology of Ti/Al/Pt/WSi/Ti/Au and Ti/Al/Pt/W/Ti/Au ohmic contacts to AlGaN/GaN heterostructures relative to the standard Ti/Al/Pt/Au metallization. The W- and WSi-based contacts show comparable specific resistivities to that of the standard contact on similar layer structures, reaching minimum values of ∼10−5 Ω cm2 after annealing in the range 850–900 °C. However, the W- and WSi-based contacts exhibit much smoother surface morphologies, even after 950 °C annealing. For example, the root-mean-square roughness of the Ti/Al/Pt/WSi/Ti/Au contact annealed at 950 °C was unchanged from the as-deposited values whereas the Ti/Al/Pt/Au contact shows significant deterioration of the morphology under these conditions. The improved thermal stability of the W- and WSix-based contacts is important for maintaining edge acuity during high-temperature operation.A comparison was made of specific contact resistivity and morphology of Ti/Al/Pt/WSi/Ti/Au and Ti/Al/Pt/W/Ti/Au ohmic contacts to AlGaN/GaN heterostructures relative to the standard Ti/Al/Pt/Au metallization. The W- and WSi-based contacts show comparable specific resistivities to that of the standard contact on similar layer structures, reaching minimum values of ∼10−5 Ω cm2 after annealing in the range 850–900 °C. However, the W- and WSi-based contacts exhibit much smoother surface morphologies, even after 950 °C annealing. For example, the root-mean-square roughness of the Ti/Al/Pt/WSi/Ti/Au contact annealed at 950 °C was unchanged from the as-deposited values whereas the Ti/Al/Pt/Au contact shows significant deterioration of the morphology under these conditions. The improved thermal stability of the W- and WSix-based contacts is important for maintaining edge acuity during high-temperature operation.

RF Power Measurements of InAlN/GaN Unstrained HEMTs on SiC Substrates at 10 GHz

Unstrained high-electron mobility transistors (HEMTs) were fabricated from InAlN/GaN on semi-insulating SiC substrates. The devices had 0.24-mum T-gates with a total width of 2times150 mum. Final passivated performance values for these devices are I_max=1279 mA/mm, I_DSS=1182 mA/mm, R_c=0.43 Omegamiddotmm, rho_s=315 Omega/sq, f_T=45 GHz, f_max(MAG)=64 GHz, and g_m=268 mS/mm. Continuous-wave power measurements at 10 GHz produced P_sat=3.8 W/mm, G_t=8.6 dB, and PAE=30% at V_DS=20 V at 25% I_DSS. To our knowledge, these are the first power measurements reported at 10 GHz for this material