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Dive into the research topics where Tae-eun Kim is active.

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Featured researches published by Tae-eun Kim.


international solid-state circuits conference | 2016

7.5 A 128Gb 2b/cell NAND flash memory in 14nm technology with tPROG=640µs and 800MB/s I/O rate

Seung-Jae Lee; Jin-Yub Lee; Il-Han Park; Jong-Yeol Park; Sung-Won Yun; Min-Su Kim; Jong-Hoon Lee; Minseok S. Kim; Kangbin Lee; Tae-eun Kim; ByungKyu Cho; Dooho Cho; Sangbum Yun; Jung-No Im; Hyejin Yim; Kyung-Hwa Kang; Suchang Jeon; Sungkyu Jo; Yang-Lo Ahn; Sung-Min Joe; S. Kim; Deok-kyun Woo; Jiyoon Park; Hyun Wook Park; Young-Min Kim; Jonghoon Park; Yongsu Choi; Makoto Hirano; Jeong-Don Ihm; Byung-Hoon Jeong

NAND flash memory is widely used as a cost-effective storage with high performance [1-2]. This paper presents a 128Gb multi-level cell (MLC) NAND flash memory with a 150 cells/string structure in 14nm CMOS that can be used as a cost-effective storage device. This paper also introduces several approaches to compensate for reliability and performance degradations caused by the 14nm transistors and the 150 cells/string structure. A technique was developed to suppress the background pattern dependency (BPD) by applying a low voltage to upper word lines (WLs) - the drain side(SSL side) WLs with respect to the location of the selected WL - during the verify sequence. Two techniques are also used to improve the program performance: equilibrium pulse scheme and smart start bias control scheme (SBC) in the MSB page. In addition, the first cycle recovery (FCR) of read enable (RE) and the bi-directional data strobe (DQS) is used to achieve a high speed I/O rate. As a result, a 640μs program time and a 800MB/s I/O rate is achieved.


Archive | 2010

Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers, and methods of fabricating same

Woon-Seong Kwon; Hyuek-Jae Lee; Tae-Je Cho; Yong-hwan Kwon; Jung-Hwan Kim; Chiyoung Lee; Tae-eun Kim


Archive | 2007

Variable resistance non-volatile memory devices including a uniformly narrow contact layer and methods of manufacturing same

Chung-Ki Min; Tae-eun Kim; Byoung-moon Yoon


Archive | 2013

FLEXIBLE DISPLAY DEVICE AND METHOD OF CONTROLLING THE SAME

Chul-Woo Jeong; Soon-Ryong Park; Woo-Suk Jung; Jung-Ho So; Tae-eun Kim


Archive | 2012

FLEXIBLE ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

Woo-Suk Jung; Soon-Ryong Park; Hye-Jung Park; Seok-Gi Baek; Tae-eun Kim


Archive | 2009

Chemical-mechanical polishing method for polishing phase-change material and method of fabricating phase-change memory device using the same

Joon-Sang Park; Chung-Ki Min; Dong-Keun Kim; Yeol Jon; Chang-sun Hwang; Tae-eun Kim


Archive | 2010

BACKLIGHT UNIT AND DISPLAY MODULE APPLYING THE SAME

Tae-Joon Kim; Tae-eun Kim; Young-Bee Chu


Archive | 2010

Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers

Woon-Seong Kwon; Hyuek-Jae Lee; Tae-Je Cho; Yong-hwan Kwon; Jung-Hwan Kim; Chiyoung Lee; Tae-eun Kim


Archive | 2013

OPTICAL FILM AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE INCLUDING THE SAME

Woo-Suk Jung; Soon-Ryong Park; Hye-Jung Park; Seok-Gi Baek; Tae-eun Kim


Archive | 2012

Display Apparatus Having Bimetal Element Which Can Be Controllably Bent

Tae-eun Kim

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