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Publication
Featured researches published by Tae-Soo Lim.
Electronic Materials Letters | 2017
Van Luong Nguyen; Sang Hoon Kim; Jae Won Jeong; Tae-Soo Lim; Dong-Yeol Yang; Ki Bong Kim; Young Ja Kim; Jun Hong Lee; Yong-Jin Kim; Sangsun Yang
AbstractTernary Bi-31.5Sn-25.0In solder has been proposed and studied for application in temperature-sensitive electronic components. In a Bi-31.5Sn- 25.0In solder joint, In was detected in an intermetallic compound (IMC) layer formed at the solder/Cu substrate interface with a thickness of 4.8 μm. The microstructure of the bulk solder consisted of Sn-rich phases distributed in Bi-rich phases with dispersion of In in both phases. Meanwhile, the nanomechanical properties of the Bi-31.5Sn-25.0In solder showed great strain rate sensitivity. To be specific, hardness increased from 9.91 MPa to 56.84 MPa as the strain rate increased in the range of (0.0005-0.125) s−1. The strain-rate sensitivity exponent (m) was found to be 0.28, indicating that the excellent ductility was shown for the solder tested under the present conditions.
Corrosion Science | 2016
Sang Hoon Kim; K.N. Hui; Yong-Jin Kim; Tae-Soo Lim; Dong-Yeol Yang; Ki Bong Kim; Young Ja Kim; Sangsun Yang
Materials & Design | 2016
Sang Hoon Kim; K.N. Hui; Yong-Jin Kim; Tae-Soo Lim; Dong-Yeol Yang; Ki Bong Kim; Young Ja Kim; Gwang Joo Jang; Sangsun Yang
Metals | 2016
Sang Hoon Kim; Min Jeong Son; Van Luong Nguyen; Tae-Soo Lim; Dong-Yeol Yang; Min-Hyeong Kim; Ki Bong Kim; Young Ja Kim; Jun Hong Lee; Yang Do Kim; In-Young Kim; Taik-Min Lee; Yong-Jin Kim; Sangsun Yang
Materials Transactions | 2013
Sangsun Yang; Ji-Na Gwak; Tae-Soo Lim; Yong-Jin Kim; Jung-Yeul Yun
Metals | 2015
Dong-Yeol Yang; Youngja Kim; Min Young Hur; Hae June Lee; Yong-Jin Kim; Tae-Soo Lim; Ki-Bong Kim; Sangsun Yang
Archive | 2009
Yong-Jin Kim; Sangsun Yang; Tae-Soo Lim
Journal of Korean Powder Metallurgy Institute | 2016
Jae Won Jeong; Dong-Yeol Yang; Ki Bong Kim; Junhong Lee; Young Ja Kim; Tae-Soo Lim; Sangsun Yang; Min Ha Lee; Hwi Jun Kim; Yong-Jin Kim
Thermochimica Acta | 2014
Su-In Lee; Jung-Yeul Yun; Tae-Soo Lim; Byoung-Kee Kim; Young-Min Kong; Jei-Pil Wang; Dong Won Lee
Materials Transactions | 2014
Sang Hoon Kim; Yong-Jin Kim; Tae-Soo Lim; Dong-Yeol Yang; Sangsun Yang
