Takahiro Tsunoda

A study on phenoxy-resin esters of cinnamylideneacetic acid and its derivatives

Abstract Photocrosslinkable polymers were prepared from phenoxy resin which was photoactivated by esterifying cinnamylideneacetic acid, α-cyanocinnamylideneacetic acid or cinnamylidenepyruvic acid. Relative sensitivities and spectral sensitivities of these polymers were determined by comparing with the phenoxy resin ester of cinnamic acid. It was found that the polymer which was photo-activated with cinnamylidenepyruvic acid had the highest photosensitivity and its spectral sensitivity extended up to 500 nm without the aid of any additional sensitizing dye. The mechanism of the photocrosslinking of these polymers was also considered.

PHOTOCHEMICAL IMAGE FORMATION PROCESS FOR HIGH DENSITY PRINTED CIRCUIT PATTERNS

A new method for fabricating high density printed circuit boards has been investigated. The procedure used for photoselective metal deposition on the substrate consists of five steps: adhesion treatment, sensitization, nucleation, fog inhibition and electroless metal deposition. An adhesive coated substrate was sensitized by introducing an aqueous solution containig anthraquinone sulfonic acid sodium salts, reducible noble metal salts and alcohol. The sensitized substrate was then exposed through a mask to a u.v. light. The noble metal nuclei produced by exposure were developed by electroless copper deposition after rinsing with aqueous solutions containing complex agents. Electrically-conductive patterns thus obtained can be further intensified by second electroless plate making.