Takayuki Hirabayashi

A novel integrated passive substrate fabricated directly on an organic laminate for RF applications

We report here a novel integrated passive substrate using thin film technology directly fabricated on multi-layer laminates. The thin film part consists of electroplated Cu interconnect and low-loss BCB dielectric fabricated on flattened PPE laminated substrate. According to microstrip-based approaches, inductor, capacitor and resistor structures were optimized and very high-Q inductors and capacitors were obtained. The separating routing design scheme between the thin film part and the multi-layer laminate part makes the RF-module compact and shows superior isolation performance.