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Publication


Featured researches published by Teruo Murase.


Archive | 1995

Controlled impedence interposer substrate

Solomon I. Beilin; William T. Chou; David Kudzuma; Michael G. Lee; Michael G. Peters; James Roman; Som S. Swamy; Wen-chou Vincent Wang; Larry L. Moresco; Teruo Murase


Archive | 1994

Multichip module substrate

Solomon I. Beilin; William T. Chou; David Kudzuma; Michael G. Lee; Teruo Murase; Michael G. Peters; James Roman; Som S. Swamy; Wen-chou V. Wang


Archive | 1998

Controlled impedance interposer substrate and method of making

Solomon I. Beilin; William T. Chou; David Kudzuma; Michael G. Lee; Michael G. Peters; James Roman; Som S. Swamy; Wen-chou Vincent Wang; Larry L. Moresco; Teruo Murase


Archive | 1978

Method of manufacturing multilayer ceramic board

Koichi Niwa; Teruo Murase; Masatoshi Fujimori; Kyohei Murakawa


Archive | 1979

Connector device for printed boards

Teruo Murase; Kyoichiro Kawano; Akiyoshi Oshitani


Archive | 1989

Connector apparatus for high density coaxial cables

Kouji Ishikawa; Kyoichiro Kawano; Teruo Murase; Jerzy R. Sochor; C. Timothy Norman


Archive | 1991

Method of making an engineering change to a printed wiring board

Mikio Nishihara; Teruo Murase; Kiyotaka Seyama; Kiyoshi Kuwabara; Osamu Ohshima


Archive | 1996

Method of making a multichip module substrate

Solomon I. Beilin; William T. Chou; David Kudzuma; Michael G. Lee; Teruo Murase; Michael G. Peters; James Roman; Som S. Swamy; Wen-chou Vincent Wang


Archive | 2000

Thermo-electric signal coupler

Larry L. Moresco; Vivek Mansingh; Teruo Murase


Archive | 1990

Electrical connecting apparatus

Hiroki Tsuji; Kyoichiro Kawano; Teruo Murase

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