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Dive into the research topics where Tetsuya Koyama is active.

Publication


Featured researches published by Tetsuya Koyama.


Archive | 2008

Method of manufacturing a multilayer wiring board

Tetsuya Koyama; Tsuyoshi Kobayashi; Hiroyuki Kato; Yoshihiro Machida


Archive | 2013

ELECTRONIC COMPONENT INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT INCORPORATED SUBSTRATE

Koichi Tanaka; Nobuyuki Kurashima; Hajime Iizuka; Tetsuya Koyama


ECTC | 2011

Warpage and electrical performance of embedded device package, MCeP

Kouichi Tanaka; Nobuyuki Kurashima; Hajime Iizuka; Kiyoshi Ooi; Yoshihiro Machida; Tetsuya Koyama


Archive | 1996

Advanced CSP and Substrate Technologies

Tetsuya Koyama; Masayuki Sasaki; Shinichi Wakabayashi


Archive | 2014

ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Nobuyuki Kurashima; Tetsuya Koyama; Hajime Iizuka; Koichi Tanaka


Journal of Japan Institute of Electronics Packaging | 2017

Development of Embedded Device Package, MCeP ® (Molded Core embedded Package)

Kouichi Tanaka; Yoshihiro Machida; Atsushi Nakamura; Masato Umehara; Tetsuya Koyama


International Symposium on Microelectronics | 2017

Development of Thinner POP Base Package by Die Embedded and RDL Structure

Masahiro Kyozuka; Takahiko Kiso; Hiroki Toyazaki; Koichi Tanaka; Tetsuya Koyama


Archive | 2016

ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECTRONIC PART EMBEDDED SUBSTRATE

Takaharu Yamano; Hajime Iizuka; Hideaki Sakaguchi; Toshio Kobayashi; Tadashi Arai; Tsuyoshi Kobayashi; Tetsuya Koyama; Kiyoaki Iida; Tomoaki Mashima; Koichi Tanaka; Yuji Kunimoto; Takashi Yanagisawa


International Symposium on Microelectronics | 2016

The Die Embedded and RDL structure on the high density substrate (i-THOP®) for mobile application

Masahiro Kyozuka; Tatsuro Yoshida; Noriyoshi Shimizu; Koichi Tanaka; Tetsuya Koyama


Archive | 2013

Electronic component built-in substrate

Nobuyuki Kurashima; Tetsuya Koyama; Hajime Ilzuka; Koichi Tanaka

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