Thalia Dominguez Bucio

Surface-Grating-Coupled Low-Loss Ge-on-Si Rib Waveguides and Multimode Interferometers

Germanium-on-silicon is a highly promising platform for planar photonics for the midinfrared, due to germaniums wide transparency range. In this letter, we report Ge-on-Si waveguides with record low losses of only 0.6 dB/cm, which is achieved using a 2.9-μm thick germanium layer, thus minimizing mode interaction with dislocations at the germanium/silicon interface. Using these waveguides, multimode interferometers with insertion losses of only 0.21 ± 0.02 dB are also demonstrated.

Silicon Photonic Waveguides and Devices for Near- and Mid-IR Applications

Silicon photonics has been a very buoyant research field in the last several years mainly because of its potential for telecom and datacom applications. However, prospects of using silicon photonics for sensing in the mid-IR have also attracted interest lately. In this paper, we present our recent results on waveguide-based devices for near- and mid-infrared applications. The silicon-on-insulator platform can be used for wavelengths up to 4 μm; therefore, different solutions are needed for longer wavelengths. We show results on passive Si devices such as couplers, filters, and multiplexers, particularly for extended wavelength regions and finally present integration of photonics and electronics integrated circuits for high-speed applications.

Material and optical properties of low-temperature NH3-free PECVD SiNx layers for photonic applications

SiN x layers intended for photonic applications are typically fabricated using LPCVD and PECVD. These techniques rely on high-temperature processing (>400 °C) to obtain low propagation losses. An alternative version of PECVD SiN x layers deposited at temperatures below 400 °C with a recipe that does not use ammonia (NH3-free PECVD) was previously demonstrated to be a good option to fabricate strip waveguides with propagation losses <3 dB cm−1. We have conducted a systematic investigation of the influence of the deposition parameters on the material and optical properties of NH3-free PECVD SiN x layers fabricated at 350 °C using a design of experiments methodology. In particular, this paper discusses the effect of the SiH4 flow, RF power, chamber pressure and substrate on the structure, uniformity, roughness, deposition rate, refractive index, chemical composition, bond structure and H content of NH3-free PECVD SiN x layers. The results show that the properties and the propagation losses of the studied SiN x layers depend entirely on their compositional N/Si ratio, which is in fact the only parameter that can be directly tuned using the deposition parameters along with the film uniformity and deposition rate. These observations provide the means to optimise the propagation losses of the layers for photonic applications through the deposition parameters. In fact, we have been able to fabricate SiN x waveguides with H content <20%, good uniformity and propagation losses of 1.5 dB cm−1 at 1550 nm and <1 dB cm−1 at 1310 nm. As a result, this study can potentially help optimise the properties of the studied SiN x layers for different applications.

Towards a fully functional integrated photonic-electronic platform via a single SiGe growth step.

Silicon-germanium (Si1-xGex) has become a material of great interest to the photonics and electronics industries due to its numerous interesting properties including higher carrier mobilities than Si, a tuneable lattice constant, and a tuneable bandgap. In previous work, we have demonstrated the ability to form localised areas of single crystal, uniform composition SiGe-on-insulator. Here we present a method of simultaneously growing several areas of SiGe-on-insulator on a single wafer, with the ability to tune the composition of each localised SiGe area, whilst retaining a uniform composition in that area. We use a rapid melt growth technique that comprises of only a single Ge growth step and a single anneal step. This innovative method is key in working towards a fully integrated photonic-electronic platform, enabling the simultaneous growth of multiple compositions of device grade SiGe for electro-absorption optical modulators operating at a range of wavelengths, photodetectors, and bipolar transistors, on the same wafer. This is achieved by modifying the structural design of the SiGe strips, without the need to modify the growth conditions, and by using low cost, low thermal-budget methods.

Photonic crystal waveguides on silicon rich nitride platform

We demonstrate design, fabrication, and characterization of two-dimensional photonic crystal (PhC) waveguides on a suspended silicon rich nitride (SRN) platform for applications at telecom wavelengths. Simulation results suggest that a 210 nm photonic band gap can be achieved in such PhC structures. We also developed a fabrication process to realize suspended PhC waveguides with a transmission bandwidth of 20 nm for a W1 PhC waveguide and over 70 nm for a W0.7 PhC waveguide. Using the Fabry-Pérot oscillations of the transmission spectrum we estimated a group index of over 110 for W1 PhC waveguides. For a W1 waveguide we estimated a propagation loss of 53 dB/cm for a group index of 37 and for a W0.7 waveguide the lowest propagation was 4.6 dB/cm.

Localised tuneable composition single crystal silicon-germanium-on-insulator for low cost devices

The realisation of high quality silicon-germanium-on-insulator (SGOI) is a major goal for the field of silicon photonics because it has the potential to enable extremely low power active devices functioning at the communication wavelengths of 1.3 µm and 1.55 µm. In addition, SGOI has the potential to form faster electronic devices such as BiCMOS transistors, and could also form the backbone of a new silicon photonics platform that extends into the mid-IR wavelengths for applications in, amongst others, sensing and telecoms. In this paper, we present a novel method of forming single crystal, defect free SGOI using a rapid melt growth technique. We use tailored structures to form localised uniform composition SGOI strips, which are suitable for state of the art device fabrication. This technique could pave the way for the seamless integration of electronic and photonic devices using only a single, low cost Ge deposition step.

Athermal silicon nitride angled MMI wavelength division (de)multiplexers for the near-infrared

WDM components fabricated on the silicon-on-insulator platform have transmission characteristics that are sensitive to dimensional errors and temperature variations due to the high refractive index and thermo-optic coefficient of Si, respectively. We propose the use of NH3-free SiNx layers to fabricate athermal (de)multiplexers based on angled multimode interferometers (AMMI) in order to achieve good spectral responses with high tolerance to dimensional errors. With this approach we have shown that stoichiometric and N-rich SiNx layers can be used to fabricate AMMIs with cross-talk <30dB, insertion loss <2.5dB, sensitivity to dimensional errors <120pm/nm, and wavelength shift <10pm/°C.

Dataset for N-Rich Silicon Nitride Angled-MMI for coarse wavelength division (de)multiplexing in the O-band

Data supporting the paper Dominguez Bucio, Thalia, Khokhar, Ali, Mashanovich, G and Gardes, F (2018) N-Rich Silicon Nitride Angled-MMI for coarse wavelength division (de)multiplexing in the O-band. Optics Letters.

56 Gbps Si/GeSi integrated EAM

The growing demand for fast, reliable and low power interconnect systems requires the development of efficient and scalable CMOS compatible photonic devices, in particular optical modulators. In this paper, we demonstrate an innovative electro absorption modulator (EAM) developed on an 800 nm SOI platform; the device is integrated in a rib waveguide with dimensions of a 1.5 µm x 40 µm, etched on a selectively grown GeSi cavity. High speed measurements at 1566 nm show an eye diagram with dynamic ER of 5.2 dB at 56 Gbps with a power consumption of 44 fJ/bit.The growing demand for fast, reliable and low power interconnect systems requires the development of efficient and scalable CMOS compatible photonic devices, in particular optical modulators. In this paper, we demonstrate an innovative electro absorption modulator (EAM) developed on an 800 nm SOI platform; the device is integrated in a rib waveguide with dimensions of a 1.5 μm x 40 μm, etched on a selectively grown GeSi cavity. High speed measurements at 1566 nm show an eye diagram with dynamic ER of 5.2 dB at 56 Gbps with a power consumption of 44 fJ/bit.

Tunable index back end of line platform for enhanced integrated photonics

We demonstrate a back end of line compatible SiN based material with tunable refractive index enabling low optical loss, high non-linear Kerr response, low index photonic crystals, high efficiency couplers, low loss waveguides and temperature tolerant MUX for DWDM.