Theodor Nielsen

PMMA to SU-8 bonding for polymer based lab-on-a-chip systems with integrated optics

An adhesive bonding technique for wafer-level sealing of SU-8 based lab-on-a-chip microsystems with integrated optical components is presented. Microfluidic channels and optical components, e.g. waveguides, are fabricated in cross-linked SU-8 and sealed with a Pyrex glass substrate by means of an intermediate layer of 950k molecular weight poly-methylmethacrylate (PMMA). Due to a lower refractive index of PMMA (n = 1.49 at λ = 600–900 nm) this bonding technique preserves waveguiding in the cross-linked SU-8 structures (n = 1.59 at λ = 633 nm) in combination with good sealing of the microfluidic channels. The bonding strength dependence on bonding temperature and bonding force is investigated. A maximum bonding strength of 16 MPa is achieved at bonding temperatures between 110 °C and 120 °C, at a bonding force of 2000 N on a 4 inch wafer. The optical propagation loss of multi-mode 10 µm (thickness) × 30 µm (width) SU-8 waveguides is measured. The propagation loss in PMMA bonded waveguide structures is more than 5 dB cm−1 lower, at wavelengths between 600 nm and 900 nm, than in similar structures bonded by an intermediate layer of SU-8. Furthermore 950k PMMA shows no tendency to flow into the bonded structures during bonding because of its high viscosity.

Imprinted silicon-based nanophotonics

We demonstrate and optically characterize silicon-on-insulator based nanophotonic devices fabricated by nanoimprint lithography. In our demonstration, we have realized ordinary and topology-optimized photonic crystal waveguide structures. The topology-optimized structures require lateral pattern definition on a sub 30-nm scale in combination with a deep vertical silicon etch of the order of ~300 nm. The nanoimprint method offers a cost-efficient parallel fabrication process with state-of-the-art replication fidelity, comparable to direct electron beam writing.

Solid state microcavity dye lasers fabricated by nanoimprint lithography

We present a solid state polymer microcavity dye laser, fabricated by thermal nanoimprint lithography (NIL) in a dye-doped thermoplast. The thermoplast poly-methylmethacrylate (PMMA) is used due to its high transparency in the visible range and its robustness to laser radiation. The laser dye is Rhodamine 6G ClO4. This dye is shown to withstand temperatures up to 240 °C without bleaching, which makes it compatible with the thermal nanoimprint lithography process. The 1.55 μm thick dye-doped PMMA devices are fabricated on a SiO2 substrate, yielding planar waveguiding in the dye-doped PMMA with two propagating TE–TM modes. The laser cavity has the lateral shape of a trapezoid, supporting lasing modes by reflection on the vertical cavity walls. The solid polymer dye lasers emit laterally through one of the vertical cavity walls, when pumped optically through the top surface by means of a frequency doubled, pulsed Nd:YAG laser. Lasing in the wavelength region from 560 to 570 nm is observed from a laser with a...

Smart plastic functionalization by nanoimprint and injection molding

In this paper, we present a route for making smart functionalized plastic parts by injection molding with sub-micrometer surface structures. The method is based on combining planar processes well known and established within silicon micro and sub-micro fabrication with proven high resolution and high fidelity with truly freeform injection molding inserts. The link between the planar processes and the freeform shaped injection molding inserts is enabled by the use of nanoimprint with flexible molds for the pattern definition combined with unidirectional sputter etching for transferring the pattern. With this approach, we demonstrate the transfer of down to 140 nm wide holes on large areas with good structure fidelity on an injection molding steel insert. The durability of the sub-micrometer structures on the inserts have been investigated by running two production series of 102,000 and 73,000 injection molded parts, respectively, on two different inserts and inspecting the inserts before and after the production series and the molded parts during the production series.

Nanoscale silicon structures by using carbon nanotubes as reactive ion etch masks

We demonstrate that multiwalled carbon nanotubes can be used as etch masks in a reactive ion etch, yielding silicon structures defined by the size and orientation of the carbon nanotube. The relationship between etch profile and reactive ion etch parameters is optimized to yield an anisotropic etch with vertical sidewalls, supporting carbon nanotubes of diameters down to 25 nm, without apparent damage to the nanotube. We demonstrate that the etched structures can be used as thermal nanoimprint stamps and that the carbon nanotube remains on the etched ridge after imprinting. The method is a route for creating nanoscale structures with a resolution defined by the smoothness and width of a macromolecular structure.

Designing visual appearance using a structured surface

We present an approach for designing nanostructured surfaces with prescribed visual appearances, starting at design analysis and ending with a fabricated sample. The method is applied to a silicon wafer structured using deep ultraviolet lithography and dry etching and includes preliminary design followed by numerical and experimental verification. The approach comprises verifying all design and fabrication steps required to produce a desired appearance. We expect that the procedure in the future will yield structurally colored surfaces with appealing prescribed visual appearances.

Technology for Fabrication of Nanostructures by Standard Cleanroom Processing and Nanoimprint Lithography

Sub-micron structures are routinely fabricated by electron beam lithography (EBL). However EBL is a time consuming and costly technology. We present a technology for fabrication of nanostructures by standard UV-lithography and thermal nanoimprint lithography (NIL). NIL-stamps with sub-30 nm patterns are fabricated by standard micrometer resolution cleanroom processing, i.e. UV-lithography, reactive ion etching and thermal oxidation, and the pattern is transferred to a polymer thin film on a substrate by NIL. Subsequently the patterned polymer film is used either as a direct etching mask to transfer the pattern to the substrate or as a metal lift-off mask. This way we have demonstrated the fabrication of sub-100 nm nanochannels in silicon oxide and sub-50 nm gold lines on silicon.

Nanoimprinted long-range surface plasmon polariton waveguide components

We report on the fabrication by nanoimprint lithography (NIL) and performance of metal stripe waveguides embedded in a polymer, capable of supporting long-range surface plasmon polariton (LRSPP) propagation.

Nanoimprint lithography of topology optimized photonic crystal devices

We demonstrate a nanoimprint process for fabrication of photonic crystal devices. The nanoimprint process, defining stamp patterns in a thin e-beam resist, yields improved pattern replication compared to direct e-beam writing of the devices.

Optical characterisation of photonic wire and photonic crystal waveguides fabricated using nanoimprint lithography

We have characterised photonic-crystal and photonic-wire waveguides fabricated by thermal nanoimprint lithography. The structures, with feature sizes down below 20 nm, are benchmarked against similar structures defined by direct electron beam lithography.