Thomas N. Adam

C- and L-band erbium-doped waveguide lasers with wafer-scale silicon nitride cavities

We report on integrated erbium-doped waveguide lasers designed for silicon photonic systems. The distributed Bragg reflector laser cavities consist of silicon nitride waveguide and grating features defined by wafer-scale immersion lithography and a top erbium-doped aluminum oxide layer deposited as the final step in the fabrication process. The resulting inverted ridge waveguide yields high optical intensity overlap with the active medium for both the 0.98 μm pump (89%) and 1.5 μm laser (87%) wavelengths with a pump-laser intensity overlap of >93%. We obtain output powers of up to 5 mW and show lasing at widely spaced wavelengths within both the C and L bands of the erbium gain spectrum (1536, 1561, and 1596 nm).

Monolithic erbium- and ytterbium-doped microring lasers on silicon chips

We demonstrate monolithic 160-µm-diameter rare-earth-doped microring lasers using silicon-compatible methods. Pump light injection and laser output coupling are achieved via an integrated silicon nitride waveguide. We measure internal quality factors of up to 3.8 × 105 at 980 nm and 5.7 × 105 at 1550 nm in undoped microrings. In erbium- and ytterbium-doped microrings we observe single-mode 1.5-µm and 1.0-µm laser emission with slope efficiencies of 0.3 and 8.4%, respectively. Their small footprints, tens of microwatts output powers and sub-milliwatt thresholds introduce such rare-earth-doped microlasers as scalable light sources for silicon-based microphotonic devices and systems.

CMOS-compatible 75 mW erbium-doped distributed feedback laser

On-chip, high-power, erbium-doped distributed feedback lasers are demonstrated in a CMOS-compatible fabrication flow. The laser cavities consist of silicon nitride waveguide and grating features, defined by wafer-scale immersion lithography and an erbium-doped aluminum oxide layer deposited as the final step in the fabrication process. The large mode size lasers demonstrate single-mode continuous wave operation with a maximum output power of 75xa0mW without any thermal damage. The laser output power does not saturate at high pump intensities and is, therefore, capable of delivering even higher on-chip signals if a stronger pump is utilized. The amplitude noise of the laser is investigated and the laser is shown to be stable and free from self-pulsing when the pump power is sufficiently above threshold.

Uniformly spaced λ/4-shifted Bragg grating array with wafer-scale CMOS-compatible process

We report on an integrated λ/4-shifted Bragg grating array using a wafer-scale complementary metal-oxide semiconductor (CMOS) compatible process with silicon-nitride waveguides. A sidewall grating was used to simplify the fabrication process, and a sampled Bragg grating with equivalent phase-shift structure was employed to achieve an accurate λ/4 phase shift. A four-channel λ/4-shifted Bragg grating array with highly uniform channel spacing was demonstrated with a measured channel spacing variation below 10xa0pm (1.25xa0GHz). The high channel-spacing uniformity and the CMOS-compatibility of the demonstrated device hold promise for integrated distributed feedback laser arrays for various silicon photonic applications.

Ultra-compact and low-threshold thulium microcavity laser monolithically integrated on silicon

We demonstrate an ultra-compact and low-threshold thulium microcavity laser that is monolithically integrated on a silicon chip. The integrated microlaser consists of an active thulium-doped aluminum oxide microcavity beside a passive silicon nitride bus waveguide, which enables on-chip pump-input and laser-output coupling. We observe lasing in the wavelength range of 1.8-1.9xa0μm under 1.6xa0μm resonant pumping and at varying waveguide-microcavity gap sizes. The microlaser exhibits a threshold as low as 773xa0μW (226xa0μW) and a slope efficiency as high as 24% (48%) with respect to the pump power coupled into the silicon nitride bus waveguide (microcavity). Its small footprint, minimal energy consumption, high efficiency, and silicon compatibility demonstrate that on-chip thulium lasers are promising light sources for silicon microphotonic systems.

Resonant pumped erbium-doped waveguide lasers using distributed Bragg reflector cavities.

This Letter reports on an optical pumping scheme, termed resonant pumping, for an erbium-doped distributed feedback (DFB) waveguide laser. The scheme uses two mirrors on either side of the DFB laser, forming a pump cavity that recirculates the unabsorbed pump light. Symmetric distributed Bragg reflectors are used as the mirrors and are designed by matching the external and internal quality factors of the cavity. Experimental demonstration shows lasing at an optical communication wavelength of around 1560 nm and an improvement of 1.8 times in the lasing efficiency, when the DFB laser is pumped on-resonance.

Wavelength division multiplexed light source monolithically integrated on a silicon photonics platform

We demonstrate monolithic integration of a wavelength division multiplexed light source for silicon photonics by a cascade of erbium-doped aluminum oxide (Al2O3:Er3+) distributed feedback (DFB) lasers. Four DFB lasers with uniformly spaced emission wavelengths are cascaded in a series to simultaneously operate with no additional tuning required. A total output power of -10.9u2009u2009dBm is obtained from the four DFBs with an average side mode suppression ratio of 38.1±2.5u2009u2009dB. We characterize the temperature-dependent wavelength shift of the cascaded DFBs and observe a uniform dλ/dT of 0.02 nm/°C across all four lasers.

Temperature varying photoconductivity of GeSn alloys grown by chemical vapor deposition with Sn concentrations from 4% to 11%

Pseudomorphic GeSn layers with Sn atomic percentages between 4.5% and 11.3% were grown by chemical vapor deposition using digermane and SnCl4 precursors on Ge virtual substrates grown on Si. The layers were characterized by x-ray diffraction rocking curves and reciprocal space maps. Photoconductive devices were fabricated, and the dark current was found to increase with Sn concentration. The responsivity of the photoconductors was measured at a wavelength of 1.55u2009μm using calibrated laser illumination at room temperature and a maximum value of 2.7u2009mA/W was measured for a 4.5% Sn device. Moreover, the responsivity for higher Sn concentration was found to increase with decreasing temperature. Spectral photoconductivity was measured using Fourier transform infrared spectroscopy. The photoconductive absorption edge continually increased in wavelength with increasing tin percentage, out to approximately 2.4u2009μm for an 11.3% Sn device. The direct band gap was extracted using Tauc plots and was fit to a bandgap model accounting for layer strain and Sn concentration. This direct bandgap was attributed to absorption from the heavy-hole band to the conduction band. Higher energy absorption was also observed, which was thought to be likely from absorption in the light-hole band. The band gaps for these alloys were plotted as a function of temperature. These experiments show the promise of GeSn alloys for CMOS compatible short wave infrared detectors.

Structural Properties of Boron-Doped Germanium-Tin Alloys Grown by Molecular Beam Epitaxy

Boron-doped Ge1−xSnx alloys with atomic fractions of tin up to x = 0.08 were grown on n-Ge(001) substrates using solid-source molecular beam epitaxy, in order to study their structural properties. The total boron concentration in the alloys was ~ 1018 cm−3 as measured by secondary-ion mass spectroscopy, which also indicated low amounts of impurities such as carbon and oxygen. More than 90% of the Sn atoms occupied substitutional lattice sites in the alloy as determined by Rutherford backscattering spectrometry. High-resolution x-ray diffraction showed that the boron-doped Ge1−xSnx alloys were single crystals that were completely strained with low defect densities and coherent interfaces for thickness up to 90 nm, and for Sn composition of 8%. The boron-doped Ge1−xSnx/n-Ge formed p–n junctions with conventional rectifying characteristics, indicating that the boron produced electrically active acceptor states.

Ultra-narrow-linewidth Al_2O_3:Er^3+ lasers with a wavelength-insensitive waveguide design on a wafer-scale silicon nitride platform

We report ultra-narrow-linewidth erbium-doped aluminum oxide (Al2O3:Er3+) distributed feedback (DFB) lasers with a wavelength-insensitive silicon-compatible waveguide design. The waveguide consists of five silicon nitride (SiNx) segments buried under silicon dioxide (SiO2) with a layer Al2O3:Er3+ deposited on top. This design has a high confinement factor (> 85%) and a near perfect (> 98%) intensity overlap for an octave-spanning range across near infra-red wavelengths (950-2000 nm). We compare the performance of DFB lasers in discrete quarter phase shifted (QPS) cavity and distributed phase shifted (DPS) cavity. Using QPS-DFB configuration, we obtain maximum output powers of 0.41 mW, 0.76 mW, and 0.47 mW at widely spaced wavelengths within both the C and L bands of the erbium gain spectrum (1536 nm, 1566 nm, and 1596 nm). In a DPS cavity, we achieve an order of magnitude improvement in maximum output power (5.43 mW) and a side mode suppression ratio (SMSR) of > 59.4 dB at an emission wavelength of 1565 nm. We observe an ultra-narrow linewidth of ΔνDPS = 5.3 ± 0.3 kHz for the DPS-DFB laser, as compared to ΔνQPS = 30.4 ± 1.1 kHz for the QPS-DFB laser, measured by a recirculating self-heterodyne delayed interferometer (R-SHDI).