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Thomas P. Glenn

Amkor Technology

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Publication

Featured researches published by Thomas P. Glenn.

Archive | 1999

Plastic integrated circuit package and method and leadframe for making the package

Thomas P. Glenn

Archive | 1998

Plastic integrated circuit device package and leadframe having partially undercut leads and die pad

Thomas P. Glenn; Scott J. Jewler; David Roman; J. H. Yee; Doo Hwan Moon

Archive | 2000

Chip size semiconductor packages with stacked dies

Thomas P. Glenn; Steven Webster; Vincent DiCaprio

Archive | 1996

Near chip size integrated circuit package

Thomas P. Glenn; Roy Dale Hollaway; Anthony E. Panczak

Archive | 1999

Molded window array for image sensor packages

Thomas P. Glenn; Steven Webster

Archive | 2000

Plastic integrated circuit device package and method for making the package

Thomas P. Glenn; Scott J. Jewler; David Roman; Jae Hak Yee; Doo Hwan Moon

Archive | 1998

RF shielded device

Thomas P. Glenn

Archive | 2003

Mounting for a package containing a chip

Thomas P. Glenn; Steven Webster; Roy Dale Hollaway

Archive | 2000

Making semiconductor packages with stacked dies and reinforced wire bonds

Anthony J. LoBianco; Frank J. Juskey; Stephen G. Shermer; Vincent DiCaprio; Thomas P. Glenn

Archive | 2000

Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components

Gary L. Swiss; Thomas P. Glenn

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Steven Webster

Amkor Technology

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Roy Dale Hollaway

Amkor Technology

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Anthony E. Panczak

Amkor Technology

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David Roman

Amkor Technology

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Scott J. Jewler

Amkor Technology

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J. H. Yee

Amkor Technology

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Vincent DiCaprio

Amkor Technology

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Doo Hwan Moon

Amkor Technology

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Markus K. Liebhard

Amkor Technology

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Gary L. Swiss

Amkor Technology

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