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Vincent DiCaprio

Amkor Technology

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Publication

Featured researches published by Vincent DiCaprio.

Archive | 2004

Semiconductor package and method for fabricating the same

Won Sun Shin; Seon Goo Lee; Do Sung Chun; Tae Hoan Jang; Vincent DiCaprio

Archive | 2000

Chip size semiconductor packages with stacked dies

Thomas P. Glenn; Steven Webster; Vincent DiCaprio

Archive | 2000

Making semiconductor packages with stacked dies and reinforced wire bonds

Anthony J. LoBianco; Frank J. Juskey; Stephen G. Shermer; Vincent DiCaprio; Thomas P. Glenn

Archive | 2000

Semiconductor package with spacer strips

Il Kwon Shim; Kambhampati Ramakrishna; Vincent DiCaprio

Archive | 2000

Semiconductor package including stacked semiconductor dies and bond wires

Thomas P. Glenn; Lee J. Smith; David A. Zoba; Kambhampati Ramakrishna; Vincent DiCaprio

Archive | 2000

Multi-stacked memory package

Il Kwon Shim; Vincent DiCaprio

Archive | 2002

Method of making a semiconductor package including stacked semiconductor dies

Thomas P. Glenn; Lee J. Smith; David A. Zoba; Kambhampati Ramakrishna; Vincent DiCaprio

Archive | 1999

Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages

Il Kwon Shim; Chang Kyu Park; Byung Joon Han; Vincent DiCaprio; Paul Hoffman

Archive | 2001

Semiconductor Package Having Semiconductor Chip Within Central Aperture Of Substrate

WonSun Shin; DoSung Chun; Sangho Lee; SeonGoo Lee; Vincent DiCaprio

Archive | 2000

Wafer level production of chip size semiconductor packages

Thomas P. Glenn; Steven Webster; Vincent DiCaprio

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Collaboration

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Il Kwon Shim

Amkor Technology

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Paul Hoffman

Amkor Technology

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Thomas P. Glenn

Amkor Technology

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Do Sung Chun

Amkor Technology

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Byung Joon Han

Amkor Technology

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DoSung Chun

Amkor Technology

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Kambhampati Ramakrishna

Amkor Technology

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SeonGoo Lee

Amkor Technology

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Won Sun Shin

Amkor Technology

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WonSun Shin

Amkor Technology

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