Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Thomas Thurman is active.

Publication


Featured researches published by Thomas Thurman.


international electronics manufacturing technology symposium | 2003

Towards next-generation design-for-manufacturability (DFM) frameworks for electronics product realization

Manas Bajaj; Russell S. Peak; Miyako Wilson; Injoong Kim; Thomas Thurman; M. C. Jothishankar; Mike Benda; Placid M. Ferreira; James A. Stori

This paper elucidates the process architecture of a pilot implementation of a DFM Framework (specifically the SFM DFM Framework or SDF), which consists of four key ingredients. The first ingredient is a Design Integrator that acquires product design information from an ECAD tool and in-house sources (each populating a subset of the design) and consolidates them into a STEP AP210 model. The second ingredient is a Rule-based Expert System (initiated at Boeing) that captures the manufacturability constraints as DFM rules and evaluates printed circuit assembly (PCA) designs against them. The third ingredient is a Design View Generator that extracts design information from the AP210 model (first ingredient) and library database and derives a Kappa design model for the expert system (second ingredient) to evaluate. The fourth ingredient is the Results Viewer that helps the user browse DFM analysis results and identify design improvement opportunities. This implementation of the SDF demonstrates the ability to extract PCA design information and build a higher fidelity standards-based design model. Additionally, it also shows the capability of Rule-based Expert Systems to emulate manufacturability checks on product (PCAs in this case) designs as well as increase analysis coverage and reduce human checking time via automation.


International Journal of Product Development | 2005

Requirements on information technology for product lifecycle management

Peter O. Denno; Thomas Thurman

Good decision-making is founded on good information. Information technology supporting product lifecycle management ought to provide a high degree of information cohesion and traceability – knowledge of the interrelations among data, and basis for belief. Providing cohesion and traceability is made difficult by differences in viewpoint and ontology employed by the various disciplines and organisations involved in the product lifecycle. This paper describes an analysis of cohesion and traceability into its constituents properties. The paper suggests that process-aware integration schema can improve the cohesion and traceability among product data.


Journal of Product Design | 2004

Requirements on Information Technology for Product Lifecycle Management

Peter O. Denno; Thomas Thurman


INCOSE International Symposium | 2008

7.2.3 On enabling a model‐based systems engineering discipline

Peter O. Denno; Thomas Thurman; John Mettenburg; Dwayne Hardy


2006 Mentor Graphics International User2User | 2006

Automating Thermo-Mechanical Warpage Estimation of PCBs/PCAs using a Design-Analysis Integration Framework

Manas Bajaj; Russell S. Peak; Dirk Zwemer; Thomas Thurman; Lothar Klein; Giedrius Liutkus; Kevin G. Brady; John V. Messina; Mike Dickerson


Grant/Contract Reports (NISTGCR) - 15-991 | 2015

Recommended practice for the representation of Component catalog data in ISO 10303-210:2014

Allison Barnard Feeney; Jamie Stori; Thomas Thurman; Kevin G. Brady


Grant/Contract Reports (NISTGCR) - 15-990 | 2015

Proposed recommended practice for the representation of schematic symbols in STEP AP 210 (ISO 10303-210)

Jamie Stori; Thomas Thurman; Craig Lanning; Mike Benda


NIST Interagency/Internal Report (NISTIR) - 7717 | 2010

Use Cases for the Management and Maintenance of Multi-Domain AP 210 Component Models

Jamie Stori; Kevin G. Brady; Thomas Thurman


NIST Interagency/Internal Report (NISTIR) - 7677 | 2010

AP210 edition 2 concept of operations

Jamie Stori; Kevin G. Brady; Thomas Thurman


NIST Interagency/Internal Report (NISTIR) - 7648 | 2009

Representation of a Thermal Resistor Network Model of a Packaged Component in STEP AP210 Edition 2

Jamie Stori; Kevin G. Brady; Thomas Thurman

Collaboration


Dive into the Thomas Thurman's collaboration.

Top Co-Authors

Avatar

Kevin G. Brady

National Institute of Standards and Technology

View shared research outputs
Top Co-Authors

Avatar

Manas Bajaj

Georgia Institute of Technology

View shared research outputs
Top Co-Authors

Avatar

Russell S. Peak

Georgia Institute of Technology

View shared research outputs
Top Co-Authors

Avatar

John V. Messina

National Institute of Standards and Technology

View shared research outputs
Top Co-Authors

Avatar

Mike Dickerson

National Institute of Standards and Technology

View shared research outputs
Top Co-Authors

Avatar

Giedrius Liutkus

National Institute of Standards and Technology

View shared research outputs
Top Co-Authors

Avatar

Lothar Klein

National Institute of Standards and Technology

View shared research outputs
Top Co-Authors

Avatar
Top Co-Authors

Avatar

Peter O. Denno

National Institute of Standards and Technology

View shared research outputs
Top Co-Authors

Avatar

A. Spradling

National Institute of Standards and Technology

View shared research outputs
Researchain Logo
Decentralizing Knowledge