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Tim V. Pham

Freescale Semiconductor

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Publication

Featured researches published by Tim V. Pham.

Archive | 2008

Dynamic pad size to reduce solder fatigue

Tim V. Pham; Trent S. Uehling

Archive | 2015

Matrix Lid Heatspreader for Flip Chip Package

George R. Leal; Tim V. Pham

Archive | 2013

PACKAGE ENCAPSULANT RELIEF FEATURE

Min Ding; Tim V. Pham

Archive | 2013

Using an integrated circuit die configuration for package height reduction

Tim V. Pham; James R. Guajardo; Michael B. McShane

Archive | 2013

FLUID COOLED SEMICONDUCTOR DIE PACKAGE

Chee Seng Foong; Tim V. Pham

Archive | 2013

RECESSED SEMICONDUCTOR DIE STACK

Tim V. Pham; Fonzell D. Martin; Derek S. Swanson

Archive | 2013

Wirebond recess for stacked die

Tim V. Pham; Michael B. McShane; Perry H. Pelley; Tab A. Stephens

Archive | 2016

DIE STACK ADDRESS BUS HAVING A PROGRAMMABLE WIDTH

Perry H. Pelley; Michael B. McShane; Tim V. Pham

Archive | 2014

DEFECTIVE DIE REPLACEMENT IN A DIE STACK

Perry H. Pelley; Michael B. McShane; Tim V. Pham

Archive | 2014

Thin Low Profile Strip Dual In-Line Memory Module

Perry H. Pelley; Michael B. McShane; Tim V. Pham

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Collaboration

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Michael B. McShane

Freescale Semiconductor

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Perry H. Pelley

Freescale Semiconductor

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George R. Leal

Freescale Semiconductor

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Trent S. Uehling

Freescale Semiconductor

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Derek S. Swanson

Freescale Semiconductor

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James R. Guajardo

Freescale Semiconductor

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Andrew C. Russell

Freescale Semiconductor

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Brett Wilkerson

Freescale Semiconductor

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Chee Seng Foong

Freescale Semiconductor

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Fonzell D. Martin

Freescale Semiconductor

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